MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Rev. 8.0 25 July 2017 Data sheet: technical data 1 General description The MPX4250A/MPXA4250A Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The MPX4250A/MPXA4250A piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on-chip integration make the NXP sensor a logical and economical choice for the automotive system engineer. 2 Features 1.5 % maximum error over 0 C to 85 C Specifically designed for intake manifold absolute pressure sensing in engine control systems Patented silicon shear stress strain gauge Temperature compensated over 40 C to +125 C Offers reduction in weight and volume compared to existing hybrid modules Durable epoxy unibody element or thermoplastic small outline, surface mount package Ideal for non-automotive applications Available in three small outline packages and two unibody packages MPXA4250A6U MPXA4250AC6U/C6T1 MPX4250A MPX4250AP 98ASB17756C 98ASB17757C 98ASB42793B 98ASB42796B CASE 482-01 CASE 482A-01 CASE 867-08 CASE 867B-04 Figure 1.Small outline and unibody packages 3 Typical applications Turbo boost engine control Ideally suited for microprocessor or microcontroller-based systemsNXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated 4 Ordering information Table 1.Ordering information of Ports Pressure type Package Package Device Device name Options Name marking None Single Dual Gauge Differential Absolute Small outline package (MPXA4250A series) MPXA4250A6U Rail 98ASB17756C MPXA4250A MPXA4250AC6U Rail 98ASB17757C MPXA4250A MPXA4250AC6T1 Tape and Reel 98ASB17757C MPXA4250A Unibody package (MPX4250A series) MPX4250A Tray 98ASB42793B MPX4250A MPX4250AP Tray 98ASB42796B MPX4250A 5 Block diagram V CC 2 (Small outline package) 3 (Unibody) Sensing Thin Film Gain Stage 2 Element Temperature and Ground V OUT Reference Compensation 1 (Unibody) Shift and 4 (Small outline package) Gain Stage 1 Circuitry Pins 4, 5 and 6 are NO CONNECTS 2 (Unibody) for unibody package devices. 3 (Small outline package) GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices. Figure 2.Block diagram 6 Pinning information 6.1 Pinning MPX4250A MPXA4250A (unibody) (SOP) DNC 1 5 DNC V 2 6 DNC CC GND 3 7 DNC V OUT 4 8 DNC 1 2 3 4 5 6 Figure 3.Pinning diagram MPx4250A All information provided in this document is subject to legal disclaimers. NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 25 July 2017 2 / 16 V OUT GND V CC DNC DNC DNC