NXP Semiconductors Document Number: MPXH6400A Data Sheet: Technical Data Rev. 6, 03/2017 MPXH6400A, 20 to 400 kPa, Absolute, MPXH6400A Integrated Pressure Sensor The NXP MPXxx6400A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration Super small outline package make this pressure sensor a logical and economical choice for the system designer. The MPXxx6400A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPXHZ6400A6T1 MPXH6400AC6U/6T1/ Case 98ARH99066A MPXHZ6400AC6T1 Features Case 98ARH99089A Improved accuracy at high temperature Available in super small outline package Top view 1.5% maximum error over 0 C to 85 C Fully calibrated and compensated Ideally suited for microprocessor or microcontroller-based systems DNC 5 4 V OUT Temperature compensated from -40 C to +125 C DNC 6 3 GND Durable thermoplastic surface mount package DNC 7 2 V S DNC 8 1 DNC Package porting and mounting options enable tube attachment for liquefied natural gas (LPG) or remote sensing applications Typical applications Fuel injected car engines Pin 1 identification, chamfered corner. Vehicles powered by green gases (for example LPG and CNG) Pinout Small engines Industrial controls Ordering information of Ports Pressure type Device Part number Shipping Package marking None Single Dual Gauge Differential Absolute Super Small Outline Package (Media resistant gel) MPXH6400AC6U Rail 98ARH99089A MPXH6400A MPXH6400AC6T1 Tape and Reel 98ARH99089A MPXH6400A MPXHZ6400A6T1 Tape and Reel 98ARH99066A MPXHZ6400A MPXHZ6400AC6T1 Tape and Reel 98ARH99089A MPXHZ6400A NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. NXP B.V. 2017Contents 1 General Description 3 1.1 Block diagram . 3 1.2 Pinout . 3 2 Mechanical and Electrical Specifications . 4 2.1 Maximum ratings . 4 2.2 Operating characteristics 4 3 On-chip Temperature Compensation and Calibration 5 4 Package Information 8 4.1 Minimum recommended footprint for surface mounted applications . 8 4.2 Package Dimensions . 9 5 Revision History 14 Related Documentation The MPXxx6400A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the MPXx6400 web page at