Freescale Semiconductor Document Number: MPXHZ6116A
Data Sheet: Technical Data Rev. 2.1, 06/2015
MPXHZ6116A, 20 to 115 kPa,
MPXHZ6116A
Absolute, Integrated Pressure Sensor
The MPXHZ6116A series pressure sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The sensors packaging has been designed to
Super small outline package
provide resistance to high humidity conditions as well as common automotive
media. The small form factor and high reliability of on-chip integration make this
sensor a logical and economical choice for the system designer.
The MPXHZ6116A series pressure sensor is a state-of-the-art, monolithic, signal
conditioned sensor designed for a wide range of applications, but particularly
those employing a microcontroller or microprocessor with A/D inputs. This
MPXHZ6116A6U/6T1
piezoresistive transducer combines advanced micromachining techniques, thin-
Case 98ARH99066A
film metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
Features
Top view
Resistant to high humidity and common automotive media
1.5% maximum error over 0 C to 85 C
DNC 5 4 V
OUT
Temperature compensated from -40 C to +125 C
DNC 6 3 GND
Durable thermoplastic (PPS) surface mount package (SSOP)
DNC 7 2 V
S
Ideally suited for microprocessor or microcontroller-based systems
DNC 8 1 DNC
Pin 1 identification,
chamfered corner
Pinout
Ordering information
# of Ports Pressure type
Device
Part number Shipping Package
marking
None Single Dual Gauge Differential Absolute
Small Outline Package (MPXHZ6116A series)
98ARH99066A
MPXHZ6116A6U Rail MPHZ6116A
98ARH99066A
MPXHZ6116A6T1 Tape and Reel MPHZ6116A
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
2009. 2010, 2015 Freescale Semiconductor, Inc. All rights reserved.Contents
1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Minimum recommended footprint for super small packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Related Documentation
The MPXHZ6116A device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1. Go to the Freescale homepage at: