Freescale Semiconductor Document Number: MPXHZ6130A Data Sheet: Technical Data Rev. 1.2, 06/2015 MPXHZ6130A, 15 to 130 kPa, MPXHZ6130A Absolute, Integrated Pressure Sensor The MPXHZ6130A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor s packaging has been designed to provide resistance Super small outline packages to high humidity conditions as well as common automotive media. The small form factor and high reliability of on-chip integration make this pressure sensor a logical choice for the system designer. The MPXHZ6130A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar MPXHZ6130A6U MPXHZ6130AC6U semiconductor processing to provide an accurate, high level analog output signal Case 98ARH99066A Case 98ARH99089A that is proportional to applied pressure. Features 1.5% maximum error over 0 C to 85 C Top view Resistant to high humidity and common automotive media Improved accuracy at high temperature DNC 5 4 V OUT Ideally suited for microprocessor or microcontroller-based systems DNC 6 3 GND Temperature compensated from -40 C to +125 C DNC 7 2 V S Durable thermoplastic (PPS) surface mount package DNC 8 1 DNC Typical applications Aviation altimeters Pin 1 identification, Industrial controls chamfered corner Engine control/manifold absolute pressure (MAP) Pinout Weather stations and weather reporting devices Ordering information of Ports Pressure type Device Part number Shipping Package marking None Single Dual Gauge Differential Absolute Small Outline Package (MPXHZ6130A series) 98ARH99066A MPXHZ6130A6U MPXHZ6130A Rail 98ARH99089A MPXHZ6130AC6U MPXHZ6130A Rail Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2006-2010, 2012, 2015 Freescale Semiconductor, Inc. All rights reserved.Contents 1 General Description 3 1.1 Block diagram . 3 1.2 Pinout . 3 2 Mechanical and Electrical Specifications . 4 2.1 Maximum ratings . 4 2.2 Operating characteristics 4 3 On-chip Temperature Compensation and Calibration 5 4 Package Information 7 4.1 Minimum recommended footprint for super small packages . 7 4.2 Package dimensions 8 5 Revision History 13 Related Documentation The MPXHZ6130A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: