MPXV7002DP NXP

MPXV7002 Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Rev. 5 5 May 2021 Product data sheet 1 General description The MPXV7002 series piezoresistive transducers are monolithic silicon pressure sensors. The MPXV7002 is designed for a wide range of applications, particularly applications employing a microcontroller, or microprocessor with analog-to-digital inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. 2 Features and benefits Ideally suited for microprocessor or microcontroller-based systems Thermoplastic (PPS) surface mount package Temperature compensated over +10 C to +60 C Patented silicon shear stress strain gauge Available in differential and gauge configurations 3 Applications Hospital beds HVAC Respiratory systems Process control 4 Ordering information Table 1.Ordering information Type number Package Name Description Version MPXV7002DP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x SOT1693-1 7.62 mm body MPXV7002GC SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67 mm x 10.67 mm x SOT1854-1 12.96 mm body MPXV7002GP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06mm x 12.06mm x SOT1693-3 8.38mm bodyNXP Semiconductors MPXV7002 Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and calibrated 4.1 Ordering options Table 2.Ordering options of Ports Pressure type SOT Package Device Device name options no. marking None Single Dual Gauge Differential Absolute Small Outline Package (MPXV7002 Series) MPXV7002DP Trays SOT1693-1 MPXV7002DP MPXV7002DPT1 Tape & Reel SOT1693-1 MPXV7002DP MPXV7002GC6U Rails SOT1854-1 MPXV7002G MPXV7002GP Trays SOT1693-3 MPXV7002G Small outline packages MPXV7002DP/DPT1 MPXV7002GC6U/C6T1 MPXV7002GP CASE 1351-01 CASE 482A-01 CASE 1369-01 SOT1693-1 SOT1854-1 SOT1693-3 5 Block diagram V S 2 THIN FILM GAIN STAGE 2 TEMPERATURE AND 4 Sensing COMPENSATION GROUND V out element AND REFERENCE GAIN STAGE 1 SHIFT CIRCUITRY 3 Pins 1, 5, 6, 7 and 8 are NO CONNECTS for small outline package device GND aaa-040606 Figure 1.Integrated pressure sensor schematic MPXV7002 All information provided in this document is subject to legal disclaimers. NXP B.V. 2021. All rights reserved. Product data sheet Rev. 5 5 May 2021 2 / 18