NTB0104 Dual supply translating transceiver auto direction sensing 3-state Rev. 3 10 November 2011 Product data sheet 1. General description The NTB0104 is a 4-bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features two 4-bit input-output ports (An and Bn), one output enable input (OE) and two supply pins (V and V ). V CC(A) CC(B) CC(A) can be supplied at any voltage between 1.2 V and 3.6 V and V can be supplied at any CC(B) voltage between 1.65 V and 5.5 V, making the device suitable for translating between any of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to V and pins Bn are referenced to V . A LOW CC(A) CC(B) level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is fully specified for partial power-down applications using I . The I circuitry disables OFF OFF the output, preventing the damaging backflow current through the device when it is powered down. 2. Features and benefits Wide supply voltage range: V : 1.2 V to 3.6 V and V : 1.65 V to 5.5 V CC(A) CC(B) I circuitry provides partial Power-down mode operation OFF Inputs accept voltages up to 5.5 V ESD protection: HBM JESD22-A114E Class 2 exceeds 2500 V for A port HBM JESD22-A114E Class 3B exceeds 15000 V for B port MM JESD22-A115-A exceeds 200 V CDM JESD22-C101E exceeds 1500 V (For NTB0104UK 1000 V) Latch-up performance exceeds 100 mA per JESD 78B Class II Multiple package options Specified from 40 Cto+85 C and 40 Cto+125 CNTB0104 NXP Semiconductors Dual supply translating transceiver auto direction sensing 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature Name Description Version range NTB0104BQ 40 Cto+125 C DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1 thin quad flat package no leads 14 terminals body 2.5 3 0.85 mm NTB0104GU12 40 C to +125 C XQFN12 plastic, extremely thin quad flat package no leads SOT1174-1 12 terminals body 1.70 2.0 0.50 mm NTB0104UK 40 C to +125 C WLCSP12 wafer level chip-size package, 12 bumps body 1.20 NTB0104UK 1.60 0.56 mm. (Backside Coating included) 4. Marking Table 2. Marking Type number Marking code NTB0104BQ B0104 NTB0104GU12 t4 NTB0104UK t04 NTB0104 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 10 November 2011 2 of 26