NX20P5090UKAZ NXP

NX20P5090 High voltage USB PD power switch Rev. 1 14 October 2016 Product data sheet 1. General description The NX20P5090 is an advanced 5 A unidirectional power switch for USB PD. It includes under voltage lockout, over voltage lockout, reverse current protection and over-temperature protection circuits. It is designed to automatically isolate the power switch terminals when a fault condition occurs. Both VBUS and VINT pins have 29 V tolerance in shutdown mode. Two NX20P5090 chips can be used in parallel to support dual power inputs connecting to the same charging circuit. The device has a default 23 V over voltage protection threshold, and the OVP threshold can be adjusted by using an external resistor divider on OVLO pin. A 15 ms de-bounce time is deployed every time before the device is switched ON, followed by a soft start to limit the inrush current. Designed for operation from 2.5 V to 20 V, it is used in USB PD power control applications to offer essential protection and enhance system reliability. NX20P5090 is offered in a small 15 bump, 2.56 x 1.54 x 0.555 mm WLCSP package. 2. Features and benefits Wide supply voltage range from 2.5 V to 20 V I maximum 5 A continuous current SW 29 V tolerance on both VBUS and VINT pin 30 m (typical) Low ON resistance Adjustable VBUS over voltage protection Built in slew rate control for inrush current limit All time two level reverse-current protection Protection circuitry Over-Temperature Protection Over-Voltage Protection Under-Voltage Lockout Reverse Current Protection Surge protection: IEC61000-4-5 exceeds 90 V on VBUS without capacitor IEC61000-4-5 exceeds 100 V on VBUS with 22 uF capacitorNX20P5090 NXP Semiconductors High voltage USB PD power switch ESD protection IEC61000-4-2 contact discharge exceeds 8 kV on VBUS HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV CDM AEC standard Q100-01 (JESD22-C101E) Specified from 40 C to +85 C 3. Applications Smart and feature phones Tablets, eBooks Notebooks 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version NX20P5090UK 40 C to +85 C WLCSP15 wafer level chip-scale package 15 bumps SOT1392-1 2.56 x 1.54 x 0.555 mm (Backside coating included) 4.1 Ordering options Table 2. Ordering options Type number Orderable Package Packing method Minimum Temperature range part number order quantity NX20P5090UK NX20P5090UKAZ WLCSP15 REEL 7 Q2/T3 3000 T = 40 C to +85 C amb *SPECIAL MARK CHIPS DP 5. Marking Table 3. Marking Line Marking Description A X20PPD basic type name B mmmmmmmnn wafer lot code (mmmmmm) and wafer number (nn) C ZtDYYWW manufacturing code: Z = foundry location t = assembly location D = RoHS code (dark green) YY = assembly year code WW = assembly week code NX20P5090 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved. Product data sheet Rev. 1 14 October 2016 2 of 28