X-On Electronics has gained recognition as a prominent supplier of NX3P1108UKZ Power Switch ICs - Power Distribution across the USA, India, Europe, Australia, and various other global locations. NX3P1108UKZ Power Switch ICs - Power Distribution are a product manufactured by NXP. We provide cost-effective solutions for Power Switch ICs - Power Distribution, ensuring timely deliveries around the world.

NX3P1108UKZ NXP

NX3P1108UKZ electronic component of NXP
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Part No.NX3P1108UKZ
Manufacturer: NXP
Category: Power Switch ICs - Power Distribution
Description: Power Switch ICs - Power Distribution Logic controlled hi-side Pwr switch
Datasheet: NX3P1108UKZ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.522 ea
Line Total: USD 0.52 
Availability - 55424
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
55424
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 0.522
10 : USD 0.4241
100 : USD 0.3194
500 : USD 0.2764
1000 : USD 0.2201
4000 : USD 0.2067
8000 : USD 0.1852
24000 : USD 0.1852

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Number of Outputs
On Resistance - Max
On Time - Max
Operating Supply Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Mounting Style
Package / Case
Supply Current - Max
Packaging
Brand
Off Time - Max
Switch Current - Max
Maximum Power Dissipation
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Pd - Power Dissipation
Product Type
Subcategory
Taric
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the NX3P1108UKZ from our Power Switch ICs - Power Distribution category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NX3P1108UKZ and other electronic components in the Power Switch ICs - Power Distribution category and beyond.

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NX3P1108 Logic controlled high-side power switch Rev. 2 20 June 2018 Product data sheet 1. General description The NX3P1108 is a high-side load switch which features a low ON resistance P-channel MOSFET that supports more than 1.5 A of continuous current. It has an integrated output discharge resistor to discharge the output capacitance when disabled. Designed for operation from 0.9 V to 3.6 V, it is used in power domain isolation applications to reduce power dissipation and extend battery life. The enable logic includes integrated logic level translation making the device compatible with lower voltage processors and controllers. The NX3P1108 is ideal for portable, battery operated applications due to low ground current and ultra-low OFF-state current. 2. Features and benefits Wide supply voltage range from 0.9 V to 3.6 V Very low ON resistance: 34 m at a supply voltage of 3.3 V High noise immunity Low OFF-state leakage current (2.0 A maximum) 1.2 V control logic at a supply voltage of 3.6 V High current handling capability (1.5 A continuous current) Internal output discharge resistor Turn-on slew rate limiting ESD protection: HBM JESD22-A114F Class 3A exceeds 4000 V CDM AEC-Q100-011 revision B exceeds 500 V Specified from 40 C to +85 C 3. Applications Cell phone Digital cameras and audio devices Portable and battery-powered equipmentNX3P1108 NXP Semiconductors Logic controlled high-side power switch 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version NX3P1108UK 40 C to +85 C WLCSP4 wafer level chip-scale package 4 bumps 0.97 SOT1376-2 mm x 0.97 mm x 0.54 mm body (backside coating included) 5. Marking Table 2. Marking codes Type number Marking code NX3P1108UK xB 6. Functional diagram 9,1 9 5 GFK / 6+,)7(9(/ (1 7 6/( 5 &(: / , 6 2 EN VIN VOUT 001aao342 DDD Fig 1. Logic symbol Fig 2. Logic diagram (simplified schematic) 7. Pinning information 7.1 Pinning EXP S 1 3 LQGH DUHD 9,1 % % *1 (1 DDD DDD Q RS YDUW W7UZVSHLDQH HZSDUWRS QQYL7UVW DH Fig 3. Pin configuration for WLCSP4 Fig 4. Ball mapping for WLCSP4 NX3P1108 All information provided in this document is subject to legal disclaimers. NXP B.V. 2018. All rights reserved. Product data sheet Rev. 2 20 June 2018 2 of 16 92 87 &+ 5*( 1 2172/5 287

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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