OM7625/BGA7124/19/5,598 NXP

BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Rev. 3 9 September 2010 Product data sheet 1. Product profile 1.1 General description The BGA7124 MMIC is a one-stage amplifier, available in a low-cost leadless surface-mount package. It delivers 25 dBm output power at 1 dB gain compression and superior performance up to 2700 MHz. Its power saving features include easy quiescent current adjustment enabling class-AB operation and logic-level shutdown control to reduce the supply current to 4 A. 1.2 Features and benefits 400 MHz to 2700 MHz frequency operating range 16 dB small signal gain at 2 GHz 25 dBm output power at 1 dB gain compression Integrated active biasing External matching allows broad application optimization of the electrical performance 3.3 V or 5 V single supply operation All pins ESD protected 1.3 Applications Wireless infrastructure (base station, E-metering repeater, backhaul systems) Broadband CPE/MoCA Satellite Master Antenna TV (SMATV) Industrial applications WLAN/ISM/RFID 1.4 Quick reference data Table 1. Quick reference data Input and output impedances matched to 50 , SHDN = HIGH (shutdown disabled). Typical values at V =5V I = 130 mA T =25 C unless otherwise specified. CC CC case Symbol Parameter Conditions Min Typ Max Unit 1 I supply current V = 5.0 V 50 - 170 mA CC CC 2 f frequency 400 - 2700 MHz G power gain f = 2140 MHz 14.5 16 17.5 dB p P output power at 1 dB gain compression f = 2140 MHz 23.5 24.5 - dBm L(1dB) 3 IP3 output third-order intercept point f = 2140 MHz 34.5 37.5 - dBm O 1 The supply current is adjustable see Section 8.1 Supply current adjustment. 2 Operation outside this range is possible but not guaranteed. 3 P = 11 dBm per tone spacing = 1 MHz. LBGA7124 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 2. Pinning information 2.1 Pinning terminal 1 index area n.c. 1 8 ICQ ADJ V 2 7 RF IN CC(RF) BGA7124 V 3 6 SHDN CC(RF) n.c. 4 5 V CC(BIAS) GND PAD 014aab046 Transparent top view Fig 1. HVSON8 package pin configuration 2.2 Pin description Table 2. Pin description Symbol Pin Description n.c. 1, 4 not connected 2, 3 RF output for the power amplifier and DC supply input for the V CC(RF) 1 RF transistor collector 2 V 5 bias supply voltage CC(BIAS) SHDN 6 shutdown control function enabled/disabled 1 RF IN 7 RF input for the power amplifier ICQ ADJ 8 quiescent collector current adjustment controlled by an external resistor 3 GND GND pad RF and DC ground 1 This pin is DC-coupled and requires an external DC-blocking capacitor. 2 RF decoupled. 3 The center metal base of the SOT908-1 also functions as heatsink for the power amplifier. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGA7124 HVSON8 plastic thermal enhanced very thin small outline SOT908-1 package no leads 8 terminals body 3 3 0.85 mm BGA7124 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 9 September 2010 2 of 33