PCA2002DUS/DAZ NXP

PCA2002 32 kHz watch circuit with programmable output period and pulse width Rev. 9 6 December 2019 Product data sheet 1. General description 1 The PCA2002 is a CMOS integrated circuit for battery operated wrist watches with a 32 kHz quartz crystal as the timing element and a bipolar stepping motor. The quartz crystal oscillator and the frequency divider are optimized for minimum current consumption. A timing accuracy of 1 ppm is achieved with a programmable, digital frequency adjustment. The output period and the output pulse width can be programmed. It can be selected between a full output pulse or a chopped output pulse with a duty cycle of 75 %. In addition, a stretching pulse can be added to the primary driving pulse. A pad RESET is provided (used for stopping the motor) for accurate time setting and for accelerated testing of the watch. 2. Features and benefits Amplitude-regulated 32 kHz quartz crystal oscillator, with excellent frequency stability and high immunity to leakage currents Electrically programmable time calibration with 1 ppm resolution stored in One Time Programmable (OTP) memory The quartz crystal is the only external component required Very low current consumption: typically 90 nA Output pulses for bipolar stepping motors Five different programmable output periods (1 s to 30 s) Output pulse width programmable between 1 ms and 8 ms Full or chopped motor pulse and pulse stretching, selectable Stop function for accurate time setting and current saving during shelf life Test mode for accelerated testing of the mechanical parts of the watch Test bits for type recognition 3. Applications Driver circuits for bipolar stepping motors High immunity motor drive circuits High production volumes 1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 14.PCA2002 NXP Semiconductors 32 kHz watch circuit with programmable output period and pulse width 4. Ordering information Table 1. Ordering information Type number Topside Package 1 marking Name Description Version PCA2002U/AB/1 PC wire bond die 8 bonding pads PCA200xU 2002-1 1.16 0.86 0.22 mm PCA2002U/10AB/1 PC wire bond die 8 bonding pads PCA200xU 2002-1 1.16 0.86 0.22 mm PCA2002DUS/DA PC WLCSP8 wafer level chip-size package 8 bumps SOT1455-1 2002-1 1.16 mm x 0.86 mm 1 Marking PC2002-1 on active side of die 4.1 Ordering options Table 2. Ordering options Type number Orderable Package Packing method Minimum Temperature part number order quantity PCA2002U/AB/1 PCA2002U/AB/1,026 wire bond bare die chip in tray 36000 T = 10 C to +60 C amb die PCA2002U/10AB/1 PCA2002U/10AB/1,00 wire bond sawn wafer on Film 45192 T = 10 C to +60 C amb die Frame Carrier (FFC), see Figure 17 PCA2002DUS/DA PCA2002DUS/DAZ WLCSP8 Reel 7 Q1 in tape 4000 T = 10 C to +60 C amb reel dry pack PCA2002 All information provided in this document is subject to legal disclaimers. NXP B.V. 2019. All rights reserved. Product data sheet Rev. 9 6 December 2019 2 of 31