PCA85073A Automotive tiny Real-Time Clock/calendar with alarm function 2 and I C-bus Rev. 1 4 October 2019 Product data sheet 1. General description 1 The PCA85073A is a CMOS Real-Time Clock (RTC) and calendar optimized for low power consumption. An offset register allows fine-tuning of the clock. All addresses and 2 data are transferred serially via the two-line bidirectional I C-bus. Maximum data rate is 400 kbit/s. The register address is incremented automatically after each written or read data byte. For a selection of NXP Real-Time Clocks, see Table 44 on page 51 2. Features and benefits AEC-Q100 grade 2 compliant for automotive applications Provides year, month, day, weekday, hours, minutes, and seconds based on a 32.768 kHz quartz crystal Low current typical 0.25 Aat V = 3.0 V and T =25 C DD amb Programmable clock output for peripheral devices (32.768 kHz, 16.384 kHz, 8.192 kHz, 4.096 kHz, 2.048 kHz, 1.024 kHz, and 1 Hz) Alarm function Minute and half minute interrupt Internal Power-On Reset (POR) High temperature operation range: 40 C to +105 C Clock operating voltage: 0.9 V to 5.5 V 2 400 kHz two-line I C-bus interface (at V = 1.8 V to 5.5 V) DD Selectable integrated oscillator load capacitors for C =7pF or C =12.5pF L L Countdown timer Oscillator stop detection function Programmable offset register for frequency adjustment Latch-up performance exceeds 100 mA per JESD 78, Class II ESD protection exceeds JESD 22 4000 V Human-Body Model (A114-A) 1000 V Charged-Device Model (C101) Package offered: TSSOP8 1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 21.PCA85073A NXP Semiconductors 2 Automotive Real-Time Clock/calendar with alarm function and I C-bus 3. Applications Tracking time of the day Accurate timing Dashboard Infotainment unit Air condition Center stack Telematics Body control and battery management 4. Ordering information Table 1. Ordering information Type number Topside Package marking Name Description Version 1 PCA85073ADP/Q900 073Q TSSOP8 plastic thin shrink small outline package 8 leads body SOT505-1 width 3 mm 1 Drop-in replacement for PCA85063ATT/A. The PCA85073ADP/Q900 leadframe is rougher for higher resistance to package delamination. 4.1 Ordering options Table 2. Ordering options Type number Orderable part number Package Packing method Minimum Temperature order quantity PCA85073ADP/Q900 PCA85073ADP/Q900Z TSSOP8 REEL 13 Q1 2500 T = 40 C to +105 C amb 1 NDP SSB 1 This Packing Method uses a Static Shielding Bag (SSB) solution. Material shall be kept in the sealed bag between uses. PCA85073A All information provided in this document is subject to legal disclaimers. NXP B.V. 2019. All rights reserved. Product data sheet Rev. 1 4 October 2019 2 of 58