PK30N512VLL100 NXP

Document Number: K30P100M100SF2 Freescale Semiconductor Rev. 6, 9/2011 Data Sheet: Technical Data K30P100M100SF2 K30 Sub-Family Data Sheet Supports the following: MK30DN512ZVLL10 Features Human-machine interface Operating Characteristics Segment LCD controller supporting up to 40 Voltage range: 1.71 to 3.6 V frontplanes and 8 backplanes, or 44 frontplanes and Flash write voltage range: 1.71 to 3.6 V 4 backplanes Temperature range (ambient): -40 to 105C Low-power hardware touch sensor interface (TSI) General-purpose input/output Performance Up to 100 MHz ARM Cortex-M4 core with DSP Analog modules instructions delivering 1.25 Dhrystone MIPS per Two 16-bit SAR ADCs MHz Programmable gain amplifier (PGA) (up to x64) integrated into each ADC Memories and memory interfaces 12-bit DAC Up to 512 KB program flash memory on non- Three analog comparators (CMP) containing a 6-bit FlexMemory devices DAC and programmable reference input Up to 128 KB RAM Voltage reference Serial programming interface (EzPort) Timers Clocks Programmable delay block 3 to 32 MHz crystal oscillator Eight-channel motor control/general purpose/PWM 32 kHz crystal oscillator timer Multi-purpose clock generator Two 2-channel quadrature decoder/general purpose timers System peripherals Periodic interrupt timers 10 low-power modes to provide power optimization 16-bit low-power timer based on application requirements Carrier modulator transmitter Memory protection unit with multi-master Real-time clock protection 16-channel DMA controller, supporting up to 64 Communication interfaces request sources Two Controller Area Network (CAN) modules External watchdog monitor Three SPI modules Software watchdog Two I2C modules Low-leakage wakeup unit Five UART modules Secure Digital host controller (SDHC) Security and integrity modules I2S module Hardware CRC module to support fast cyclic redundancy checks 128-bit unique identification (ID) number per chip Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20102011 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4.2 Thermal attributes.................................................20 1.1 Determining valid orderable parts......................................3 6 Peripheral operating requirements and behaviors....................20 2 Part identification......................................................................3 6.1 Core modules....................................................................20 2.1 Description.........................................................................3 6.1.1 Debug trace timing specifications.........................21 2.2 Format...............................................................................3 6.1.2 JTAG electricals....................................................21 2.3 Fields.................................................................................3 6.2 System modules................................................................24 2.4 Example............................................................................4 6.3 Clock modules...................................................................24 3 Terminology and guidelines......................................................4 6.3.1 MCG specifications...............................................24 3.1 Definition: Operating requirement......................................4 6.3.2 Oscillator electrical specifications.........................27 3.2 Definition: Operating behavior...........................................5 6.3.3 32kHz Oscillator Electrical Characteristics............29 3.3 Definition: Attribute............................................................5 6.4 Memories and memory interfaces.....................................30 3.4 Definition: Rating...............................................................6 6.4.1 Flash (FTFL) electrical specifications....................30 3.5 Result of exceeding a rating..............................................6 6.4.2 EzPort Switching Specifications............................32 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................32 requirements......................................................................6 6.6 Analog...............................................................................33 3.7 Guidelines for ratings and operating requirements............7 6.6.1 ADC electrical specifications.................................33 3.8 Definition: Typical value.....................................................7 6.6.2 CMP and 6-bit DAC electrical specifications.........41 3.9 Typical value conditions....................................................8 6.6.3 12-bit DAC electrical characteristics.....................44 4 Ratings......................................................................................8 6.6.4 Voltage reference electrical specifications............47 4.1 Thermal handling ratings...................................................9 6.7 Timers................................................................................48 4.2 Moisture handling ratings..................................................9 6.8 Communication interfaces.................................................48 4.3 ESD handling ratings.........................................................9 6.8.1 CAN switching specifications................................48 4.4 Voltage and current operating ratings...............................9 6.8.2 DSPI switching specifications (limited voltage 5 General.....................................................................................10 range)....................................................................49 5.1 AC electrical characteristics..............................................10 6.8.3 DSPI switching specifications (full voltage range).50 5.2 Nonswitching electrical specifications...............................10 6.8.4 I2C switching specifications..................................52 5.2.1 Voltage and current operating requirements.........10 6.8.5 UART switching specifications..............................52 5.2.2 LVD and POR operating requirements.................12 6.8.6 SDHC specifications.............................................52 5.2.3 Voltage and current operating behaviors..............12 6.8.7 I2S switching specifications..................................53 5.2.4 Power mode transition operating behaviors..........13 6.9 Human-machine interfaces (HMI)......................................55 5.2.5 Power consumption operating behaviors..............14 6.9.1 TSI electrical specifications...................................55 5.2.6 EMC radiated emissions operating behaviors.......17 6.9.2 LCD electrical characteristics................................56 5.2.7 Designing with radiated emissions in mind...........18 7 Dimensions...............................................................................58 5.2.8 Capacitance attributes..........................................18 7.1 Obtaining package dimensions.........................................58 5.3 Switching specifications.....................................................18 8 Pinout........................................................................................58 5.3.1 Device clock specifications...................................18 8.1 K30 Signal Multiplexing and Pin Assignments..................58 5.3.2 General switching specifications...........................18 8.2 K30 Pinouts.......................................................................62 5.4 Thermal specifications.......................................................19 9 Revision History........................................................................63 5.4.1 Thermal operating requirements...........................19 K30 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011. 2 Freescale Semiconductor, Inc.