PK30N512VMC100 NXP

Document Number: K30P121M100SF2 Freescale Semiconductor Rev. 7, 02/2013 Data Sheet: Technical Data K30P121M100SF2 K30 Sub-Family Data Sheet Supports the following: MK30DN512ZVMC10 Features Human-machine interface Operating Characteristics Segment LCD controller supporting up to 40 Voltage range: 1.71 to 3.6 V frontplanes and 8 backplanes, or 44 frontplanes and Flash write voltage range: 1.71 to 3.6 V 4 backplanes, depending on the package size Temperature range (ambient): -40 to 105C Low-power hardware touch sensor interface (TSI) General-purpose input/output Performance Up to 100 MHz ARM Cortex-M4 core with DSP Analog modules instructions delivering 1.25 Dhrystone MIPS per Two 16-bit SAR ADCs MHz Programmable gain amplifier (PGA) (up to x64) integrated into each ADC Memories and memory interfaces Two 12-bit DACs Up to 512 KB program flash memory on non- Three analog comparators (CMP) containing a 6-bit FlexMemory devices DAC and programmable reference input Up to 256 KB program flash memory on Voltage reference FlexMemory devices Up to 256 KB FlexNVM on FlexMemory devices Timers 4 KB FlexRAM on FlexMemory devices Programmable delay block Up to 128 KB RAM Eight-channel motor control/general purpose/PWM Serial programming interface (EzPort) timer Two 2-channel quadrature decoder/general purpose Clocks timers 3 to 32 MHz crystal oscillator Periodic interrupt timers 32 kHz crystal oscillator 16-bit low-power timer Multi-purpose clock generator Carrier modulator transmitter Real-time clock System peripherals Multiple low-power modes to provide power Communication interfaces optimization based on application requirements Two Controller Area Network (CAN) modules Memory protection unit with multi-master Three SPI modules protection Two I2C modules 16-channel DMA controller, supporting up to 63 Six UART modules request sources Secure Digital host controller (SDHC) External watchdog monitor I2S module Software watchdog Low-leakage wakeup unit Security and integrity modules Hardware CRC module to support fast cyclic redundancy checks 128-bit unique identification (ID) number per chip Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20112013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4.2 Thermal attributes.................................................21 1.1 Determining valid orderable parts......................................3 6 Peripheral operating requirements and behaviors....................22 2 Part identification......................................................................3 6.1 Core modules....................................................................22 2.1 Description.........................................................................3 6.1.1 Debug trace timing specifications.........................22 2.2 Format...............................................................................3 6.1.2 JTAG electricals....................................................22 2.3 Fields.................................................................................3 6.2 System modules................................................................25 2.4 Example............................................................................4 6.3 Clock modules...................................................................25 3 Terminology and guidelines......................................................4 6.3.1 MCG specifications...............................................25 3.1 Definition: Operating requirement......................................4 6.3.2 Oscillator electrical specifications.........................27 3.2 Definition: Operating behavior...........................................5 6.3.3 32 kHz Oscillator Electrical Characteristics...........30 3.3 Definition: Attribute............................................................5 6.4 Memories and memory interfaces.....................................30 3.4 Definition: Rating...............................................................6 6.4.1 Flash electrical specifications................................30 3.5 Result of exceeding a rating..............................................6 6.4.2 EzPort Switching Specifications............................35 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................36 requirements......................................................................6 6.6 Analog...............................................................................36 3.7 Guidelines for ratings and operating requirements............7 6.6.1 ADC electrical specifications.................................36 3.8 Definition: Typical value.....................................................7 6.6.2 CMP and 6-bit DAC electrical specifications.........43 3.9 Typical value conditions....................................................8 6.6.3 12-bit DAC electrical characteristics.....................46 4 Ratings......................................................................................9 6.6.4 Voltage reference electrical specifications............49 4.1 Thermal handling ratings...................................................9 6.7 Timers................................................................................50 4.2 Moisture handling ratings..................................................9 6.8 Communication interfaces.................................................50 4.3 ESD handling ratings.........................................................9 6.8.1 CAN switching specifications................................50 4.4 Voltage and current operating ratings...............................9 6.8.2 DSPI switching specifications (limited voltage 5 General.....................................................................................10 range)....................................................................51 5.1 AC electrical characteristics..............................................10 6.8.3 DSPI switching specifications (full voltage range).52 5.2 Nonswitching electrical specifications...............................10 6.8.4 Inter-Integrated Circuit Interface (I2C) timing........54 5.2.1 Voltage and current operating requirements.........10 6.8.5 UART switching specifications..............................55 5.2.2 LVD and POR operating requirements.................11 6.8.6 SDHC specifications.............................................55 5.2.3 Voltage and current operating behaviors..............12 6.8.7 I2S switching specifications..................................56 5.2.4 Power mode transition operating behaviors..........14 6.9 Human-machine interfaces (HMI)......................................59 5.2.5 Power consumption operating behaviors..............15 6.9.1 TSI electrical specifications...................................59 5.2.6 EMC radiated emissions operating behaviors.......18 6.9.2 LCD electrical characteristics................................60 5.2.7 Designing with radiated emissions in mind...........19 7 Dimensions...............................................................................61 5.2.8 Capacitance attributes..........................................19 7.1 Obtaining package dimensions.........................................61 5.3 Switching specifications.....................................................19 8 Pinout........................................................................................61 5.3.1 Device clock specifications...................................19 8.1 K30 Signal Multiplexing and Pin Assignments..................61 5.3.2 General switching specifications...........................19 8.2 K30 Pinouts.......................................................................66 5.4 Thermal specifications.......................................................20 9 Revision History........................................................................67 5.4.1 Thermal operating requirements...........................20 K30 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013. 2 Freescale Semiconductor, Inc.