PSMN9R0-30LL,115 NXP

PSMN9R0-30LL N-channel DFN3333-8 30 V 9 m logic level MOSFET Rev. 5 13 December 2011 Product data sheet 1. Product profile 1.1 General description Logic level N-channel MOSFET in DFN3333-8 package qualified to 150 C. This product is designed and qualified for use in a wide range of industrial, communications and power supply equipment. 1.2 Features and benefits High efficiency due to low switching Suitable for logic level gate drive and conduction losses sources Small footprint for compact designs 1.3 Applications Battery protection Load switching DC-to-DC converters Power ORing 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V drain-source voltage T 25 C; T 150 C - - 30 V DS j j I drain current T =25 C; V =10V; --21 A D mb GS see Figure 1 P total power dissipation T =25 C; see Figure 2 --50 W tot mb T junction temperature -55 - 150 C j Static characteristics R drain-source on-state resistance V =4.5 V; I =5A; T =25C; - 10.6 13 m DSon GS D j see Figure 12 V =10V; I =5A; T =100 C; --11.9m GS D j see Figure 13 V =10V; I =5A; T =25C; - 89m GS D j see Figure 12 DFN3333-8PSMN9R0-30LL NXP Semiconductors N-channel DFN3333-8 30 V 9 m logic level MOSFET Table 1. Quick reference data continued Symbol Parameter Conditions Min Typ Max Unit Dynamic characteristics Q gate-drain charge V =10V; I =10A; V =15V; -2.9 -nC GD GS D DS see Figure 14; see Figure 17 Q total gate charge - 20.6 - nC G(tot) V =4.5 V; I =10A; V =15V; -10 -nC GS D DS see Figure 17; see Figure 14 Avalanche ruggedness E non-repetitive drain-source V =10V; T =25C; --32 mJ DS(AL)S GS j(init) avalanche energy I =40A; V 30 V; unclamped; D sup R =50 GS 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1S source 8 765 D 2S source 3S source G 4 G gate mbb076 S 5,6,7,8 D drain 1 234 mb Transparent top view SOT873-1 (DFN3333-8) 3. Ordering information Table 3. Ordering information Type number Package Name Description Version PSMN9R0-30LL DFN3333-8 plastic thermal enhanced very thin small outline package; no SOT873-1 leads; 8 terminals PSMN9R0-30LL All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 13 December 2011 2 of 15