Document Number S9KEA8P44M48SF0 Freescale Semiconductor Rev 4, 09/2014 Data Sheet: Technical Data S9KEA8P44M48SF0 KEA8 Sub-Family Data Sheet Supports the following: S9KEAZN8ACTG(R), S9KEAZN8ACFK(R), S9KEAZN8AMTG(R) and S9KEAZN8AMFK(R) Key features Security and integrity modules 80-bit unique identification (ID) number per chip Operating characteristics Voltage range: 2.7 to 5.5 V Human-machine interface Flash write voltage range: 2.7 to 5.5 V Up to 22 general-purpose input/output (GPIO) Temperature range (ambient): -40 to 125C Two up to 8-bit keyboard interrupt modules (KBI) External interrupt (IRQ) Performance Up to 48 MHz ARM Cortex-M0+ core Analog modules Single cycle 32-bit x 32-bit multiplier One 12-channel 12-bit SAR ADC, operation in Stop Single cycle I/O access port mode, optional hardware trigger (ADC) Two analog comparators containing a 6-bit DAC Memories and memory interfaces and programmable reference input (ACMP) Up to 8 KB flash Up to 1 KB RAM Timers One 6-channel FlexTimer/PWM (FTM) Clocks One 2-channel FlexTimer/PWM (FTM) Oscillator (OSC) - supports 32.768 kHz crystal or 4 One 2-channel periodic interrupt timer (PIT) MHz to 24 MHz crystal or ceramic resonator choice One pulse width timer (PWT) of low power or high gain oscillators One real-time clock (RTC) Internal clock source (ICS) - internal FLL with internal or external reference, 37.5 kHz pre-trimmed Communication interfaces internal reference for 48 MHz system clock One SPI module (SPI) Internal 1 kHz low-power oscillator (LPO) One UART module (UART) One I2C module (I2C) System peripherals Power management module (PMC) with three power Package options modes: Run, Wait, Stop 24-pin QFN Low-voltage detection (LVD) with reset or interrupt, 16-pin TSSOP selectable trip points Watchdog with independent clock source (WDOG) Programmable cyclic redundancy check module (CRC) Serial wire debug interface (SWD) Aliased SRAM bitband region (BIT-BAND) Bit manipulation engine (BME) Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2014 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts.......................................................................................3 4.2.2 FTM module timing....................................................... 15 1.1 Determining valid orderable parts............................................... 3 4.3 Thermal specifications.................................................................16 2 Part identification................................................................................. 3 4.3.1 Thermal characteristics.................................................. 16 2.1 Description...................................................................................3 5 Peripheral operating requirements and behaviors................................ 17 2.2 Format..........................................................................................3 5.1 Core modules............................................................................... 17 2.3 Fields............................................................................................3 5.1.1 SWD electricals .............................................................18 2.4 Example....................................................................................... 4 5.2 External oscillator (OSC) and ICS characteristics.......................19 3 Ratings..................................................................................................4 5.3 NVM specifications..................................................................... 21 3.1 Thermal handling ratings............................................................. 4 5.4 Analog..........................................................................................22 3.2 Moisture handling ratings............................................................ 4 5.4.1 ADC characteristics....................................................... 22 3.3 ESD handling ratings................................................................... 5 5.4.2 Analog comparator (ACMP) electricals.........................24 3.4 Voltage and current operating ratings..........................................5 5.5 Communication interfaces........................................................... 25 4 General................................................................................................. 6 5.5.1 SPI switching specifications.......................................... 25 4.1 Nonswitching electrical specifications........................................ 6 6 Dimensions...........................................................................................28 4.1.1 DC characteristics.......................................................... 6 6.1 Obtaining package dimensions.................................................... 28 4.1.2 Supply current characteristics........................................ 12 7 Pinout................................................................................................... 28 4.1.3 EMC performance..........................................................14 7.1 Signal multiplexing and pin assignments.................................... 28 4.2 Switching specifications.............................................................. 14 8 Revision History...................................................................................29 4.2.1 Control timing................................................................ 14 KEA8 Sub-Family Data Sheet, Rev4, 09/2014. 2 Freescale Semiconductor, Inc.