SC18IS602BIPW/S8HP NXP

SC18IS602B 2 I C-bus to SPI bridge Rev. 7 21 October 2019 Product data sheet 1. General description 2 The SC18IS602B is designed to serve as an interface between a standard I C-bus of a microcontroller and an SPI bus. This allows the microcontroller to communicate directly 2 2 with SPI devices through its I C-bus. The SC18IS602B operates as an I C-bus slave-transmitter or slave-receiver and an SPI master. The SC18IS602B controls all the SPI bus-specific sequences, protocol, and timing. The SC18IS602B has its own internal oscillator, and it supports four SPI chip select outputs that may be configured as GPIO when not used. 2. Features and benefits 2 I C-bus slave interface operating up to 400 kHz SPI master operating up to 1.8 Mbit/s 200-byte data buffer Up to four slave select outputs Up to four programmable I/O pins Operating supply voltage: 2.4 V to 3.6 V Low power mode Internal oscillator option Active LOW interrupt output ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 Latch-up testing is done to JEDEC Standard JESD78 that exceeds 100 mA Very small 16-pin TSSOP 3. Applications 2 Converting I C-bus to SPI Adding additional SPI bus controllers to an existing systemSC18IS602B NXP Semiconductors 2 I C-bus to SPI bridge 4. Ordering information Table 1. Ordering information Type number Topside Package marking Name Description Version SC18IS602BIPW/S8 IS602B TSSOP16 plastic thin shrink small outline package 16 leads SOT403-1 body width 4.4 mm 4.1 Ordering options Table 2. Ordering options Type number Orderable part number Package Packing method Minimum Temperature order quantity 1 SC18IS602BIPW/S8 SC18IS602BIPW/S8HP TSSOP16 REEL 13 Q4/T2 2500 T = 40 C to amb *STANDARD +85 C MARK SMD 1 NXP plans to supply the /S8 device with an expected discontinuation in the 2024-2025 timeframe, but in the meantime, Failure Analysis for /S8 devices will consist of Automated Test Equipment (ATE) and electrical overstress verification along with package and wire bond validation only. Detailed device failure analysis will not be available refer to CIN 201708035I. 5. Block diagram MOSI SCL MISO 2 I C-BUS BUFFER SPICLK SDA SPI SS0 SS1 (1) SS2 SS3 CONTROL REGISTER SC18IS602B RESET INTERRUPT INTERNAL INT CONTROL OSCILLATOR LOGIC 002aac443 (1) Unused slave select outputs may be used for GPIO. Fig 1. Block diagram of SC18IS602B SC18IS602B All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2019. All rights reserved. Product data sheet Rev. 7 21 October 2019 2 of 25