X-On Electronics has gained recognition as a prominent supplier of SPC5121YVY400B 32-bit Microcontrollers - MCU across the USA, India, Europe, Australia, and various other global locations. SPC5121YVY400B 32-bit Microcontrollers - MCU are a product manufactured by NXP. We provide cost-effective solutions for 32-bit Microcontrollers - MCU, ensuring timely deliveries around the world.

SPC5121YVY400B NXP

SPC5121YVY400B electronic component of NXP
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Part No.SPC5121YVY400B
Manufacturer: NXP
Category: 32-bit Microcontrollers - MCU
Description: MCU 32-bit mobileGT 51xx e300 RISC ROMLess 3.3V Automotive 516-Pin TEBGA Tray
Datasheet: SPC5121YVY400B Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
200: USD 82.4536 ea
Line Total: USD 16490.72 
Availability - 0
MOQ: 200  Multiples: 200
Pack Size: 200
Availability Price Quantity
0
Ship by Tue. 12 Nov to Mon. 18 Nov
MOQ : 200
Multiples : 200
200 : USD 82.4536

   
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We are delighted to provide the SPC5121YVY400B from our 32-bit Microcontrollers - MCU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the SPC5121YVY400B and other electronic components in the 32-bit Microcontrollers - MCU category and beyond.

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Freescale Semiconductor Document Number: MPC5121E Rev. 5, 02/2012 Data Sheet: Technical Data MPC5121E/MPC5123 516 TEPBGA 27 mm x 27 mm MPC5121E/MPC5123 Data Sheet The MPC5121e/MPC5123 integrates a high performance On-chip temperature sensor e300 CPU core based on the Power Architecture Technology IIM IC Identification module with a rich set of peripheral functions focused on communications and systems integration. Major features of the MPC5121e/MPC5123 are: e300 Power Architecture processor core Power modes include doze, nap, sleep, deep sleep, and hibernate AXE Auxiliary Execution Engine MBX Lite 2D/3D graphics engine (not available in MPC5123) DIU Display interface unit DDR1, DDR2, and LPDDR/mobile-DDR SDRAM memory controller MEM 128 KB on-chip SRAM USB 2.0 OTG controller with integrated physical layer (PHY) DMA subsystem EMB Flexible multi-function external memory bus interface NFC NAND flash controller LPC LocalPlus interface 10/100Base Ethernet PCI interface, version 2.3 PATA Parallel ATA integrated development environment (IDE) controller SATA Serial ATA controller with integrated physical layer (PHY) SDHC MMC/SD/SDIO card host controller PSC Programmable serial controller 2 I C inter-integrated circuit communication interfaces S/PDIF Serial audio interface CAN Controller area network BDLC J1850 interface VIU Video Input, ITU-656 compliant RTC On-Chip real-time clock Freescale Semiconductor, Inc., 2010-2012. All rights reserved.Table of Contents 1 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 3.3.11 FEC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 2 Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 3.3.12 USB ULPI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 2.1 516-TEPBGA Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . .5 3.3.13 On-Chip USB PHY . . . . . . . . . . . . . . . . . . . . . . 60 2.2 Pinout Listings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 3.3.14 SDHC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 3 Electrical and Thermal Characteristics. . . . . . . . . . . . . . . . . .17 3.3.15 DIU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 3.1 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . .17 3.3.16 SPDIF. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 3.1.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . .17 3.3.17 CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 2 3.1.2 Recommended Operating Conditions . . . . . . . .18 3.3.18 I C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 3.1.3 DC Electrical Specifications. . . . . . . . . . . . . . . .19 3.3.19 J1850 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 3.1.4 Electrostatic Discharge . . . . . . . . . . . . . . . . . . .22 3.3.20 PSC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 3.1.5 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . .23 3.3.21 GPIOs and Timers . . . . . . . . . . . . . . . . . . . . . . 73 3.1.6 Thermal Characteristics. . . . . . . . . . . . . . . . . . .24 3.3.22 Fusebox . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 3.2 Oscillator and PLL Electrical Characteristics . . . . . . . .25 3.3.23 IEEE 1149.1 (JTAG) . . . . . . . . . . . . . . . . . . . . . 74 3.2.1 System Oscillator Electrical Characteristics . . .26 3.3.24 VIU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 3.2.2 RTC Oscillator Electrical Characteristics. . . . . .26 4 System Design Information . . . . . . . . . . . . . . . . . . . . . . . . . . 76 3.2.3 System PLL Electrical Characteristics. . . . . . . .26 4.1 Power Up/Down Sequencing. . . . . . . . . . . . . . . . . . . . 76 3.2.4 e300 Core PLL Electrical Characteristics . . . . .27 4.2 System and CPU Core AVDD Power Supply Filtering. 76 3.3 AC Electrical Characteristics. . . . . . . . . . . . . . . . . . . . .28 4.3 Connection Recommendations . . . . . . . . . . . . . . . . . . 77 3.3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 4.4 Pull-Up/Pull-Down Resistor Requirements . . . . . . . . . 78 3.3.2 AC Operating Frequency Data. . . . . . . . . . . . . .28 4.4.1 Pull-Down Resistor Requirements for TEST pin78 3.3.3 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 4.4.2 Pull-Up Requirements for the PCI Control Lines78 3.3.4 External Interrupts . . . . . . . . . . . . . . . . . . . . . . .32 4.5 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 3.3.5 SDRAM (DDR) . . . . . . . . . . . . . . . . . . . . . . . . .32 4.5.1 TRST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 3.3.6 PCI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 4.5.2 e300 COP / BDM Interface . . . . . . . . . . . . . . . . 79 3.3.7 LPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 5 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 3.3.8 NFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 5.1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 82 3.3.9 PATA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 5.2 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . 83 3.3.10 SATA PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 6 Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 MPC5121E/MPC5123 Data Sheet, Rev. 5 2 Freescale Semiconductor

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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