Freescale Semiconductor Document Number: MPC5602P Rev. 6,12/2012 Data Sheet: Advance Information MPC5602P MPC5602P Microcontroller Data Sheet 100 LQFP (14 mm x 14 mm) 64 LQFP (10 mm x 10 mm) Up to 64 MHz, single issue, 32-bit CPU core complex 1 FlexCAN interface (2.0B Active) with 32 message (e200z0h) buffers Compliant with Power Architecture embedded 1 safety port based on FlexCAN with 32 message category buffers and up to 8 Mbit/s at 64 MHz capabilitym usable as second CAN when not used as safety port Variable Length Encoding (VLE) One 10-bit analog-to-digital converter (ADC) Memory organization Up to 16 input channels (16 ch on 100 LQFP and Up to 256 KB on-chip code flash memory with ECC 12 ch on 64 LQFP) and erase/program controller Conversion time < 1 s including sampling time at Optional: additional 64 (4 16) KB on-chip data full precision flash memory with ECC for EEPROM emulation Programmable Cross Triggering Unit (CTU) Up to 20 KB on-chip SRAM with ECC 4 analog watchdogs with interrupt capability Fail-safe protection On-chip CAN/UART bootstrap loader with Boot Assist Programmable watchdog timer Module (BAM) Non-maskable interrupt 1 FlexPWM unit Fault collection unit 8 complementary or independent outputs with ADC Nexus Class 1 interface synchronization signals Interrupts and events Polarity control, reload unit 16-channel eDMA controller Integrated configurable dead time unit and inverter 16 priority level controller fault input pins Up to 25 external interrupts 16-bit resolution PIT implements four 32-bit timers Lockable configuration 120 interrupts are routed via INTC Clock generation General purpose I/Os 440 MHz main oscillator Individually programmable as input, output or special 16 MHz internal RC oscillator function Software-controlled FMPLL capable of up to 37 on 64 LQFP 64 MHz 64 on 100 LQFP Voltage supply 1 general purpose eTimer unit 3.3 V or 5 V supply for I/Os and ADC 6 timers each with up/down capabilities On-chip single supply voltage regulator with external 16-bit resolution, cascadeable counters ballast transistor Quadrature decode with rotation direction flag Operating temperature ranges: 40 to 125 C or 40 Double buffer input capture and output compare to 105 C Communications interfaces Up to 2 LINFlex modules (1 Master/Slave, 1 Master only) Up to 3 DSPI channels with automatic chip select generation (up to 8/4/4 chip selects) This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. Freescale Semiconductor, Inc., 2011-2013. All rights reserved. Table of Contents 1 Introduction 3 3.2 Parameter classification . 33 1.1 Document overview 3 3.3 Absolute maximum ratings . 33 1.2 Description .3 3.4 Recommended operating conditions 36 1.3 Device comparison .3 3.5 Thermal characteristics 40 1.4 Block diagram .4 3.5.1 Package thermal characteristics . 40 1.5 Feature details 7 3.5.2 General notes for specifications at maximum 1.5.1 High performance e200z0 core processor 7 junction temperature 40 1.5.2 Crossbar switch (XBAR) .8 3.6 Electromagnetic interference (EMI) characteristics . 42 1.5.3 Enhanced direct memory access (eDMA) 8 3.7 Electrostatic discharge (ESD) characteristics . 42 1.5.4 Flash memory .8 3.8 Power management electrical characteristics . 42 1.5.5 Static random access memory (SRAM) 9 3.8.1 Voltage regulator electrical characteristics 42 1.5.6 Interrupt controller (INTC) 9 3.8.2 Voltage monitor electrical characteristics . 44 1.5.7 System status and configuration module 3.9 Power up/down sequencing 45 (SSCM) .10 3.10 DC electrical characteristics 47 1.5.8 System clocks and clock generation .10 3.10.1 NVUSRO register . 47 1.5.9 Frequency-modulated phase-locked loop 3.10.2 DC electrical characteristics (5 V) 47 (FMPLL) 10 3.10.3 DC electrical characteristics (3.3 V) . 50 1.5.10 Main oscillator 11 3.10.4 Input DC electrical characteristics definition 52 1.5.11 Internal RC oscillator .11 3.10.5 I/O pad current specification . 52 1.5.12 Periodic interrupt timer (PIT) .11 3.11 Main oscillator electrical characteristics . 53 1.5.13 System timer module (STM) .11 3.12 FMPLL electrical characteristics . 55 1.5.14 Software watchdog timer (SWT) 11 3.13 16 MHz RC oscillator electrical characteristics 56 1.5.15 Fault collection unit (FCU) .12 3.14 Analog-to-digital converter (ADC) electrical 1.5.16 System integration unit Lite (SIUL) .12 characteristics 56 1.5.17 Boot and censorship .12 3.14.1 Input impedance and ADC accuracy 57 1.5.18 Error correction status module (ECSM) .13 3.14.2 ADC conversion characteristics 62 1.5.19 Peripheral bridge (PBRIDGE) 13 3.15 Flash memory electrical characteristics 63 1.5.20 Controller area network (FlexCAN) 13 3.15.1 Program/Erase characteristics . 63 1.5.21 Safety port (FlexCAN) 14 3.15.2 Flash memory power supply DC 1.5.22 Serial communication interface module characteristics . 64 (LINFlex) 14 3.15.3 Start-up/Switch-off timings 65 1.5.23 Deserial serial peripheral interface (DSPI) 15 3.16 AC specifications . 65 1.5.24 Pulse width modulator (FlexPWM) 15 3.16.1 Pad AC specifications . 65 1.5.25 eTimer 16 3.17 AC timing characteristics . 66 1.5.26 Analog-to-digital converter (ADC) module .17 3.17.1 RESET pin characteristics 66 1.5.27 Cross triggering unit (CTU) 17 3.17.2 IEEE 1149.1 interface timing 69 1.5.28 Nexus Development Interface (NDI) .18 3.17.3 Nexus timing 71 1.5.29 Cyclic redundancy check (CRC) 18 3.17.4 External interrupt timing (IRQ pin) 73 1.5.30 IEEE 1149.1 JTAG controller .18 3.17.5 DSPI timing . 74 1.5.31 On-chip voltage regulator (VREG) .19 4 Package characteristics 80 2 Package pinouts and signal descriptions 19 4.1 Package mechanical data 80 2.1 Package pinouts 19 4.1.1 100 LQFP mechanical outline drawing 80 2.2 Pin description .21 4.1.2 64 LQFP mechanical outline drawing . 84 2.2.1 Power supply and reference voltage pins .21 5 Ordering information . 88 2.2.2 System pins 23 6 Document revision history . 89 2.2.3 Pin multiplexing .23 Appendix AAbbreviations . 94 3 Electrical characteristics .33 3.1 Introduction 33 MPC5602P Microcontroller Data Sheet, Rev. 6 2 Freescale Semiconductor