NXP Semiconductors Document Number: MPC5604BC Rev. 14, 11/2017 Data Sheet: Technical Data MPC5604B/C MPC5604B/C Microcontroller Data Sheet 208 MAPBGA (17 x 17 x 1.7 mm) 144 LQFP (20 x 20 x 1.4 mm) 100 LQFP (14 x 14 x 1.4 mm) 64 LQFP (10 x 10 x 1.4 mm) Features Up to 6 enhanced full CAN (FlexCAN) modules with Single issue, 32-bit CPU core complex (e200z0) configurable buffers Compliant with the Power Architecture embedded 1 inter IC communication interface (I2C) module category Up to 123 configurable general purpose pins supporting Includes an instruction set enhancement allowing input and output operations (package dependent) variable length encoding (VLE) for code size footprint Real Time Counter (RTC) with clock source from128 kHz reduction. With the optional encoding of mixed 16-bit or 16 MHz internal RC oscillator supporting autonomous and 32-bit instructions, it is possible to achieve wakeup with 1 ms resolution with max timeout of 2 significant code size footprint reduction. seconds Up to 512 KB on-chip code flash supported with the flash Up to 6 periodic interrupt timers (PIT) with 32-bit counter controller and ECC resolution 64 (4 16) KB on-chip data flash memory with ECC 1 System Module Timer (STM) Up to 48 KB on-chip SRAM with ECC Nexus development interface (NDI) per IEEE-ISTO Memory protection unit (MPU) with 8 region descriptors 5001-2003 Class Two Plus standard and 32-byte region granularity Device/board boundary Scan testing supported with per Interrupt controller (INTC) with 148 interrupt vectors, Joint Test Action Group (JTAG) of IEEE (IEEE 1149.1) including 16 external interrupt sources and 18 external On-chip voltage regulator (VREG) for regulation of interrupt/wakeup sources input supply for all internal levels Frequency modulated phase-locked loop (FMPLL) Crossbar switch architecture for concurrent access to peripherals, flash memory, or RAM from multiple bus masters Boot assist module (BAM) supports internal flash programming via a serial link (CAN or SCI) Timer supports input/output channels providing a range of 16-bit input capture, output compare, and pulse width modulation functions (eMIOS-lite) 10-bit analog-to-digital converter (ADC) 3 serial peripheral interface (DSPI) modules Up to 4 serial communication interface (LINFlex) modules NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1, Introduction .3 2.19.1 Program/Erase characteristics . 59 1.1 Document overview .3 2.19.2 Flash power supply DC characteristics 60 1.2 Description .3 2.19.3 Start-up/Switch-off timings 61 1.3 Block diagram .5 2.20 Electromagnetic compatibility (EMC) characteristics 61 2 Package pinouts and signal descriptions .7 2.20.1Designing hardened software to avoid noise 2.1 Package pinouts .7 problems 62 2.2 Pad configuration during reset phases .11 2.20.2 Electromagnetic interference (EMI) . 62 2.3 Voltage supply pins 12 2.20.3 Absolute maximum ratings (electrical sensitivity)62 2.4 Pad types .12 2.21 Fast external crystal oscillator (4 to 16 MHz) electrical 2.5 System pins .14 characteristics . 63 2.6 Functional ports 14 2.22 Slow external crystal oscillator (32 kHz) electrical 2.7 Nexus 2+ pins 30 characteristics . 66 2.8 Electrical characteristics 31 2.23 FMPLL electrical characteristics . 68 2.9 Introduction 31 2.24 Fast internal RC oscillator (16 MHz) electrical 2.10 Parameter classification 31 characteristics . 69 2.11 NVUSRO register .32 2.25 Slow internal RC oscillator (128 kHz) electrical 2.11.1 NVUSRO PAD3V5V field description 32 characteristics . 70 2.11.2 NVUSRO OSCILLATOR MARGIN field description 32 2.26 ADC electrical characteristics . 72 2.11.3 NVUSRO WATCHDOG EN field description 32 2.26.1 Introduction . 72 2.12 Absolute maximum ratings 33 2.26.2 Input impedance and ADC accuracy 72 2.13 Recommended operating conditions 34 2.26.3 ADC electrical characteristics . 77 2.14 Thermal characteristics .36 2.27 On-chip peripherals . 79 2.14.1 Package thermal characteristics 36 2.27.1 Current consumption 79 2.14.2 Power considerations .37 2.27.2 DSPI characteristics . 80 2.15 I/O pad electrical characteristics 37 2.27.3 Nexus characteristics 86 2.15.1 I/O pad types .37 2.27.4 JTAG characteristics . 87 2.15.2 I/O input DC characteristics 38 3 Package characteristics . 88 2.15.3 I/O output DC characteristics .39 3.1 Package mechanical data 88 2.15.4 Output pin transition times .42 3.1.1 64 LQFP 89 2.15.5 I/O pad current specification .42 3.1.2 100 LQFP . 92 2.16 RESET electrical characteristics 48 3.1.3 144 LQFP . 95 2.17 Power management electrical characteristics 51 3.1.4 208 MAPBGA 97 2.17.1 Voltage regulator electrical characteristics 51 4 Ordering information . 99 2.17.2 Low voltage detector electrical characteristics .56 5 Document revision history . 99 2.18 Power consumption 58 2.19 Flash memory electrical characteristics 59 MPC5604B/C Microcontroller Data Sheet, Rev. 14 2 NXP Semiconductors