Freescale Semiconductor Document Number: MPC5604BC Rev. 13, 01/2015 Data Sheet: Advance Information MPC5604B/C MAPBGA225 QFN12 144 LQFP 208 MAPBGA 15 mm x 15 mm mm x mm (20 x 20 x 1.4 mm) (17 x 17 x 1.7 mm) MPC5604B/C Microcontroller Data Sheet SOT-343R PKG-TBD mm x mm mm x mm 100 LQFP 64 LQFP TBD (14 x 14 x 1.4 mm) (10 x 10 x 1.4 mm) Up to 6 enhanced full CAN (FlexCAN) modules Features with configurable buffers Single issue, 32-bit CPU core complex (e200z0) 2 1 inter IC communication interface (I C) module Compliant with the Power Architecture Up to 123 configurable general purpose pins embedded category supporting input and output operations (package Includes an instruction set enhancement dependent) allowing variable length encoding (VLE) for Real Time Counter (RTC) with clock source from code size footprint reduction. With the optional 128 kHz or 16 MHz internal RC oscillator encoding of mixed 16-bit and 32-bit supporting autonomous wakeup with 1 ms instructions, it is possible to achieve significant resolution with max timeout of 2 seconds code size footprint reduction. Up to 6 periodic interrupt timers (PIT) with 32-bit Up to 512 KB on-chip code flash supported with the counter resolution flash controller and ECC 1 System Module Timer (STM) 64 (4 16) KB on-chip data flash memory with ECC Nexus development interface (NDI) per IEEE-ISTO Up to 48 KB on-chip SRAM with ECC 5001-2003 Class Two Plus standard Memory protection unit (MPU) with 8 region Device/board boundary Scan testing supported with descriptors and 32-byte region granularity per Joint Test Action Group (JTAG) of IEEE (IEEE Interrupt controller (INTC) with 148 interrupt 1149.1) vectors, including 16 external interrupt sources and On-chip voltage regulator (VREG) for regulation of 18 external interrupt/wakeup sources input supply for all internal levels Frequency modulated phase-locked loop (FMPLL) Crossbar switch architecture for concurrent access to peripherals, flash memory, or RAM from multiple bus masters Boot assist module (BAM) supports internal flash programming via a serial link (CAN or SCI) Timer supports input/output channels providing a range of 16-bit input capture, output compare, and pulse width modulation functions (eMIOS-lite) 10-bit analog-to-digital converter (ADC) 3 serial peripheral interface (DSPI) modules Up to 4 serial communication interface (LINFlex) modules This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. Freescale Semiconductor, Inc., 2009-2015. All rights reserved.Table of Contents 1 Introduction 3 2.19.1 Program/Erase characteristics . 56 1.1 Document overview 3 2.19.2 Flash power supply DC characteristics 57 1.2 Description .3 2.19.3 Start-up/Switch-off timings 58 2 Package pinouts and signal descriptions .7 2.20 Electromagnetic compatibility (EMC) characteristics 58 2.1 Package pinouts .7 2.20.1 Designing hardened software to avoid noise 2.2 Pad configuration during reset phases .11 problems . 58 2.3 Voltage supply pins 12 2.20.2 Electromagnetic interference (EMI) . 58 2.4 Pad types .12 2.20.3 Absolute maximum ratings (electrical sensitivity) 2.5 System pins .13 . 59 2.6 Functional ports 13 2.21 Fast external crystal oscillator (4 to 16 MHz) 2.7 Nexus 2+ pins 29 electrical characteristics . 60 2.8 Electrical characteristics 30 2.22 Slow external crystal oscillator (32 kHz) 2.9 Introduction 30 electrical characteristics . 62 2.10 Parameter classification 30 2.23 FMPLL electrical characteristics . 64 2.11 NVUSRO register .30 2.24 Fast internal RC oscillator (16 MHz) 2.11.1 NVUSRO PAD3V5V field description 30 electrical characteristics . 65 2.11.2 NVUSRO OSCILLATOR MARGIN field 2.25 Slow internal RC oscillator (128 kHz) description .31 electrical characteristics . 66 2.11.3 NVUSRO WATCHDOG EN field description 31 2.26 ADC electrical characteristics . 68 2.12 Absolute maximum ratings 32 2.26.1 Introduction . 68 2.13 Recommended operating conditions 33 2.26.2 Input impedance and ADC accuracy 68 2.14 Thermal characteristics .35 2.26.3 ADC electrical characteristics . 73 2.14.1 Package thermal characteristics 35 2.27 On-chip peripherals . 75 2.14.2 Power considerations 36 2.27.1 Current consumption 75 2.15 I/O pad electrical characteristics 36 2.27.2 DSPI characteristics . 76 2.15.1 I/O pad types .36 2.27.3 Nexus characteristics 82 2.15.2 I/O input DC characteristics 37 2.27.4 JTAG characteristics 83 2.15.3 I/O output DC characteristics .38 3 Package characteristics 84 2.15.4 Output pin transition times .40 3.1 Package mechanical data 84 2.15.5 I/O pad current specification .41 3.1.1 64 LQFP 85 2.16 RESET electrical characteristics 46 3.1.2 100 LQFP . 88 2.17 Power management electrical characteristics 48 3.1.3 144 LQFP . 91 2.17.1 Voltage regulator electrical characteristics 48 3.1.4 208 MAPBGA 93 2.17.2 Low voltage detector electrical characteristics .52 4 Ordering information . 95 2.18 Power consumption .54 5 Document revision history . 95 2.19 Flash memory electrical characteristics 56 MPC5604B/C Microcontroller Data Sheet, Rev. 13 2 Freescale Semiconductor