X-On Electronics has gained recognition as a prominent supplier of T4240NXN7PQB Microprocessors - MPU across the USA, India, Europe, Australia, and various other global locations. T4240NXN7PQB Microprocessors - MPU are a product manufactured by NXP. We provide cost-effective solutions for Microprocessors - MPU, ensuring timely deliveries around the world.

T4240NXN7PQB NXP

T4240NXN7PQB electronic component of NXP
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Part No.T4240NXN7PQB
Manufacturer: NXP
Category: Microprocessors - MPU
Description: Microprocessors - MPU 64b Power Arch 24x 1.5GHz threads
Datasheet: T4240NXN7PQB Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1147.01 ea
Line Total: USD 1147.01 
Availability - 4
Ship by Thu. 21 Nov to Mon. 25 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4
Ship by Thu. 21 Nov to Mon. 25 Nov
MOQ : 1
Multiples : 1
1 : USD 1147.01

   
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We are delighted to provide the T4240NXN7PQB from our Microprocessors - MPU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the T4240NXN7PQB and other electronic components in the Microprocessors - MPU category and beyond.

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Document Number T4240 NXP Semiconductors Rev. 1, 05/2016 Data Sheet: Technical Data T4240 QorIQ T4240 Data Sheet Features 32 SerDes lanes at up to 10 Gb/s 12 e6500 cores built on Power Architecture Ethernet interfaces technology and arranged as clusters of four e6500 Up to four 10 Gbps Ethernet MACs cores sharing a 2 MB L2 cache Up to sixteen 1 Gbps Ethernet MACs Combinations of 1 Gbps and 10 Gbps Ethernet 1.5 MB CoreNet platform cache (CPC) MACs Hierarchical interconnect fabric IEEE Std 1588 support CoreNet fabric supporting coherent and non- High-speed peripheral interfaces coherent transactions with prioritization and Four PCI Express 2.0/3.0 controllers running at up bandwidth allocation amongst CoreNet end-points to 8 GT/s with one controllers supporting end-point, 1.6 Tbps coherent read bandwidth single-root I/O virtualization (SR-IOV) Three 64-bit DDR3 SDRAM memory controllers Two Serial RapidIO 2.0 controllers running at up to DDR3 and DDR3L with ECC and interleaving 5 Gbaud support Interlaken look-aside interface for TCAM connection Data Path Acceleration Architecture (DPAA) incorporating acceleration for the following functions: Additional peripheral interfaces Packet parsing, classification, and distribution Two Serial ATA (SATA 2.0) controllers (Frame Manager 1.1) Two high-speed USB 2.0 controllers with integrated Queue management for scheduling, packet PHY sequencing, and congestion management (Queue Enhanced secure digital host controller (SD/MMC/ Manager 1.1) eMMC) Hardware buffer management for buffer allocation Enhanced Serial peripheral interface (eSPI) and de-allocation (Buffer Manager 1.1) Four I2C controllers Cryptography Acceleration (SEC 5.0) Four 2-pin UARTs or two 4-pin DUARTs RegEx Pattern Matching Acceleration (PME 2.0) Integrated flash controller supporting NAND and Decompression/Compression Acceleration (DCE NOR flash 1.0) Three 8-channel DMA engines DPAA chip-to-chip interconnect via RapidIO Message Manager (RMan 1.0) 1932 FC-PBGA package, 45 mm x 45 mm, 1mm pitch NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. 20142016 NXP B.V.Table of Contents 1 Overview.............................................................................................. 3 3.16 JTAG controller.........................................................................124 2 Pin assignments.................................................................................... 3 3.17 I2C interface.............................................................................. 127 2.1 1932 ball layout diagrams......................................................... 4 3.18 GPIO interface...........................................................................130 2.2 Pinout list...................................................................................10 3.19 High-speed serial interfaces (HSSI).......................................... 132 3 Electrical characteristics.......................................................................73 4 Hardware design considerations...........................................................188 3.1 Overall DC electrical characteristics.........................................73 4.1 System clocking........................................................................ 188 3.2 Power sequencing......................................................................80 4.2 Power supply design..................................................................204 3.3 Power-down requirements.........................................................82 4.3 Decoupling recommendations...................................................213 3.4 Power characteristics.................................................................83 4.4 SerDes block power supply decoupling recommendations.......213 3.5 Power-on ramp rate................................................................... 90 4.5 Connection recommendations................................................... 214 3.6 Input clocks............................................................................... 91 4.6 Thermal......................................................................................225 3.7 RESET initialization..................................................................96 4.7 Recommended thermal model...................................................226 3.8 DDR3 and DDR3L SDRAM controller.................................... 97 4.8 Thermal management information............................................ 226 3.9 eSPI interface.............................................................................103 5 Package information.............................................................................229 3.10 DUART interface...................................................................... 106 5.1 Package parameters for the FC-PBGA......................................229 3.11 Ethernet interface, Ethernet management interface 1 and 2, 5.2 Mechanical dimensions of the FC-PBGA................................. 229 IEEE Std 1588........................................................................... 107 6 Security fuse processor.........................................................................231 3.12 USB interface............................................................................ 116 7 Ordering information............................................................................231 3.13 Integrated flash controller..........................................................118 7.1 Part numbering nomenclature....................................................231 3.14 Enhanced secure digital host controller (eSDHC).....................121 7.2 Orderable part numbers addressed by this document................232 3.15 Multicore programmable interrupt controller (MPIC).............. 123 8 Revision history....................................................................................234 QorIQ T4240 Data Sheet, Rev. 1, 05/2016 2 NXP Semiconductors

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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