TDA1308T/N2 NXP

TDA1308 Class-AB stereo headphone driver Rev. 5 14 March 2011 Product data sheet 1. General description The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or a TSSOP8 plastic package. The device is fabricated in a 1 m Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily developed for portable digital audio applications. 2. Features and benefits Wide temperature range No switch ON/OFF clicks Excellent power supply ripple rejection Low power consumption Short-circuit resistant High performance High signal-to-noise ratio High slew rate Low distortion Large output voltage swing 3. Quick reference data Table 1. Quick reference data V =5V V =0V T =25 C f = 1 kHz R =32 unless otherwise specified. DD SS amb i L Symbol Parameter Conditions Min Typ Max Unit V supply voltage single supply 3.0 5.0 7.0 V DD dual supply 1.5 2.5 3.5 V V negative supply dual supply 1.5 2.5 3.5 V SS voltage I supply current no load - 3 5 mA DD P total power no load - 15 25 mW tot dissipation 1 P output power maximum THD+N < 0.1 % -40 80 mW o 1 THD+N total harmonic -0.030.06% distortion-plus-noise 1 - 70 65 dB R =5k - 101 - dB L S/N signal-to-noise ratio 100 110 - dBTDA1308 NXP Semiconductors Class-AB stereo headphone driver Table 1. Quick reference data continued V =5V V =0V T =25 C f = 1 kHz R =32 unless otherwise specified. DD SS amb i L Symbol Parameter Conditions Min Typ Max Unit channel separation - 70 - dB cs 1 R =5k - 105 - dB L PSRR power supply ripple f =100 Hz -90 - dB i rejection V = 100 mV ripple(p-p) T ambient temperature 40 - +85 C amb 1 V =5V V = 3.5 V (at 0 dB). DD o(p-p) 4. Ordering information Table 2. Ordering information Type number Package Name Description Version TDA1308T SO8 plastic small outline package 8 leads body width SOT96-1 3.9 mm TDA1308TT TSSOP8 plastic thin shrink small outline package 8 leads SOT505-1 body width 3 mm 5. Block diagram TDA1308 1 8 OUTA V DD 2 INA- 3 7 INA+ OUTB 6 INB- 4 V SS 5 INB+ mka779 Fig 1. Block diagram TDA1308 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 14 March 2011 2 of 17