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This literature is subject to all applicable copyright laws and is not for resale in any manner.74LCX162374 Low Voltage 16-Bit D-Type Flip-Flop with 5V Tolerant Inputs and Outputs and 26 Series Resistors February 2001 Revised May 2005 74LCX162374 Low Voltage 16-Bit D-Type Flip-Flop with 5V Tolerant Inputs and Outputs and 26 Series Resistors General Description Features The LCX162374 contains sixteen non-inverting D-type 5V tolerant inputs and outputs flip-flops with 3-STATE outputs and is intended for bus ori- 2.3V3.6V V specifications provided CC ented applications. The device is byte controlled. A buff- Equivalent 26: series resistor on outputs ered clock (CP) and Output Enable (OE) are common to 7.0 ns t max (V 3.3V), 20 PA I max each byte and can be shorted together for full 16-bit opera- PD CC CC tion. Power down high impedance inputs and outputs The LCX162374 is designed for low voltage (2.5V or 3.3V) Supports live insertion/withdrawal (Note 1) V applications with capability of interfacing to a 5V signal CC r12 mA output drive (V 3.0V) CC environment. The 26: series resistor in the output helps Implements proprietary noise/EMI reduction circuitry reduce output overshoot and undershoot. Latch-up performance exceeds 500 mA The LCX162374 is fabricated with an advanced CMOS technology to achieve high speed operation while maintain- ESD performance: ing CMOS low power dissipation. Human body model 2000V Machine model 200V Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) Note 1: To ensure the high-impedance state during power up or down, OE should be tied to V through a pull-up resistor: the minimum value or the CC resistor is determined by the current-sourcing capability of the driver. Ordering Code: Order Number Package Number Package Description 74LCX162374GX BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 2) (Preliminary) TAPE and REEL 74LCX162374MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300 Wide (Note 3) 74LCX162374MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 3) Note 2: BGA package available in Tape and Reel only. Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter X to the ordering code. Logic Symbol 2005 Fairchild Semiconductor Corporation DS500442 www.fairchildsemi.com