MC78L00A Series,
NCV78L00A
100 mA Positive Voltage
Regulators
The MC78L00A Series of positive voltage regulators are
inexpensive, easytouse devices suitable for a multitude of
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applications that require a regulated supply of up to 100 mA. Like
their higher powered MC7800 and MC78M00 Series cousins, these
regulators feature internal current limiting and thermal shutdown
making them remarkably rugged. No external components are
required with the MC78L00 devices in many applications.
These devices offer a substantial performance advantage over the
traditional zener dioderesistor combination, as output impedance
1
1
and quiescent current are substantially reduced. 2
2
3
3
STRAIGHT LEAD BENT LEAD
Features
BULK PACK TAPE & REEL
Wide Range of Available, Fixed Output Voltages
AMMO PACK
Low Cost
TO92 Pin: 1. Output
2. Ground
P SUFFIX
Internal Short Circuit Current Limiting
3. Input
CASE 029
Internal Thermal Overload Protection
No External Components Required
Complementary Negative Regulators Offered (MC79L00A Series)
NCV Prefix for Automotive and Other Applications Requiring
SOIC8*
Unique Site and Control Change Requirements; AECQ100
D SUFFIX SOT89
CASE 751 CASE 528AG
Qualified and PPAP Capable
These are PbFree Devices
*SOIC8 is an internally modified SO8 package. Pins
2, 3, 6, and 7 are electrically common to the die attach
flag. This internal lead frame modification decreases
package thermal resistance and increases power
Input
Q11
Q5
Q3 dissipation capability when appropriately mounted on
15k
a printed circuit board. SOIC8 conforms to all ex-
Q12
ternal dimensions of the standard SO8 package.
Q1
Q10
PIN CONNECTIONS
5.0k 3.0
Output
3.8k
V18 V
OUT IN
Q4 Q6
0-25k
2 7
GND GND
GND 3 6 GND
1.9k 19k 2.2k
1.2k NC 4 5
NC
Q9
C
(Top View)
Q8
Q2
TAB
Z1 2.85k
Q7
420
1.0k
Ground
12 3
V GND V
OUT IN
(Top View)
Figure 1. Representative Schematic Diagram
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 12 of this data sheet.
Semiconductor Components Industries, LLC, 1999
1 Publication Order Number:
October, 2016 Rev. 18 MC78L00A/DMC78L00A Series, NCV78L00A
MC78LXXA
Input Output
C *
in
C **
O
0.33 F
0.1 F
Figure 2. Standard Application
A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0 V above the output
voltage even during the low point on the input ripple voltage.
* C is required if regulator is located an appreciable distance from power supply filter.
in
** C is not needed for stability; however, it does improve transient response.
O
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (5.0 V9.0 V) V 30 Vdc
I
Input Voltage (12 V18 V) 35
Input Voltage (24 V) 40
Storage Temperature Range T 65 to +150 C
stg
Maximum Junction Temperature T 150 C
J
Moisture Sensitivity Level MSL 1
ESD Capability, Human Body Model (Note 1) ESD 2000 V
HBM
ESD Capability, Machine Model (Note 1) ESD 200 V
MM
ESD Capability, Charged Device Model (Note 1) ESD 2000 V
CDM
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114)
ESD Machine Model tested per AECQ100003 (EIA/JESD22A115)
ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model.
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Package Dissipation PD Internally Limited W
Thermal Characteristics, TO92 R 200 C/W
JA
Thermal Resistance, JunctiontoAmbient
Thermal Characteristics, SOIC8 R Refer to Figure 8 C/W
JA
Thermal Resistance, JunctiontoAmbient
Thermal Characteristics, SOT89 R 55 C/W
JA
Thermal Resistance, JunctiontoAmbient
2. Thermal Resistance, JunctiontoAmbient depends on P.C.B. Copper area. See details in Figure 8.
Thermal Resistance, JunctiontoCase is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages
may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is
minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board.
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2