DATA SHEET www.onsemi.com Silicon Photomultiplier (SiPM) 4-Side Scaleable Arrays ArrayC Series onsemis range of C-Series, SMT (surface mount technology) SiPM sensors have been used to create compact and scaleable arrays. The sensors are mounted onto PCB boards with minimal dead space. The ArrayC products are available in a variety of formats, and formed of pixels of different sizes. Details of the arrays available are given in the Ordering Information table on page 29 of this document. S1 S2 The back of each ArrayC has either one or more multi-way connectors, or a BGA (ball grid array), that allow access to the fast F1 F2 output* and standard I/O from each pixel in the array, and a common I/O from the summed substrates of the pixels. The ArrayC products Common with connectors can be used to interface with the users own readout via the mating connector, or to onsemis Breakout Boards (BOBs). Sn+1 Sn+2 The BOBs allow for easy access to the pixel signals and performance Fn+1 Fn+2 evaluation of the arrays. ArrayC products with the BGA can be reflow soldered to the users readout boards, or purchased ready-mounted on an Evaluation Board (EVB) for easy testing. The BGA ArrayC products cannot be removed Figure 1. Signal connections at the pixel from their EVBs. This contrasts with an ArrayC that has connectors, level of an ArrayC where multiple arrays can be evaluated with a single BOB. ArrayC Inputs and Outputs (I/O) Figure 1 summarizes the array schematic for a portion of an ArrayC. ATTENTION Each SiPM sensor in the array has three electrical connections: fast Great care should be taken when disconnecting the ArrayC PCBs from the mating connectors, either on one output*, standard output and common. of the BOBs, or the users own boards. The substrates (cathodes) of all sensors are summed together to The board should be gently levered up, working form the common I/O. progressively around the board to lever the PCB from the Each individual fast output* and standard I/O (anode) are routed to connector a little on all sides, and then repeating the its own output pin. process until the connectors are free from each other. The pixel-level performance of the sensors in the array can be found Note that a BGA ArrayC cannot be removed from its EVB. in the C-Series datasheet. Table of Contents ARRAYC600354PBGA ............................... 2 ARRAYC600354PGEVB .............................. 4 ARRAYC6003564PPCB ............................... 5 ARRAYXBOB664S .................................... 8 ARRAYXBOB664S ................................... 10 ARRAYC3003516PPCB .............................. 12 ARRAYXBOB316P ................................... 14 ARRAYXBOB316S ................................... 16 ARRAYC30035144PPCB ............................ 18 ARRAYXBOB3144P .................................. 22 Biasing and Readout from the Standard Breakout Boards .... 24 Appendix A ............................................ 26 Appendix B ............................................ 27 Appendix C ............................................ 28 Ordering Information .................................... 29 * The ARRAYC-60035-4P does not have access to the fast output. Semiconductor Components Industries, LLC, 2018 1 Publication Order Number: September, 2021 Rev. 8 ARRAYCSERIES/DArrayC Series ARRAYC-60035-4P-BGA (2 x 2 ARRAY OF 6 mm SMT SENSORS) Array Size Sensor Type Readout Board Size Pixel Pitch No. Connections No. Connectors 2 2 x 2 60035 Pixel 14.2 x 14.2 mm 7.2 mm 9 3 x 3 BGA The ARRAYC-60035-4P is comprised of 4 individual 6mm C-Series sensors arranged in a 2 x 2 array. The performance of the individual pixels and details of the bias to apply can be found in the C-Series datasheet. Connections to each sensor are provided by a BGA (ball grid array). The BGA can be used to mount the array on the users board using reflow soldering. The 4 SiPM sensors have all substrate connections (cathodes) connected together to form a common I/O. The 3 x 3 BGA provides connections as follows: 4 x standard I/O 5 x common I/O There is NO fast output Schematics for the ARRAYC-60035-4P-BGA The complete ARRAYC-60035-4P-BGA CAD and solder footprint is available to download. www.onsemi.com 2