CM1205-08CP ON Semiconductor

CM1205 ESD Protection Diode Array Chip Scale Package, 8 Channel Description The CM1205 surge protection array provides a very high level of protection for sensitive electronic components that may be subjected www.onsemi.com to ESD. The CM1205 will safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000 4 2 international standard (Level 4, 8 kV contact discharge). All I/Os are rated at 25 kV using the IEC 6100042 contact discharge method. WLCSP10 CP SUFFIX Using the MILSTD 883D (Method 3015) specification for Human CASE 567BM Body Model (HBM) ESD, all pins are protected for contact discharges to greater than 30 kV. The Chip Scale Package format of this device enables extremely BLOCK DIAGRAM small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder B1 B2 B3 B4 B5 bumps allow for standard attachment to laminate boards without the use of underfill. The CM1205 features OptiGuard coating for improved reliability at assembly and is available with RoHS compliant leadfree finishing. Features A1 A2 A3 A4 A5 Functionally and Pin Compatible with ON Semiconductors CM120508CP PACDN1408 ESD Protection Device 8 surge protection in a Single Package TM Optiguard Coated for Improved Reliability at Assembly MARKING DIAGRAM Insystem Electrostatic Discharge (ESD) Protection to 25 kV Contact Discharge per IEC 6100042 International Standard Compact Chip Scale Package (0.65 mm pitch) Format Saves Board 120508 Space and Eases Layout in Space Critical Applications Compared to Discrete Solutions and Traditional Wire Bonded Packages 10bump CSP 120508 = Specific Device Code These Devices are PbFree and are RoHS Compliant Applications ORDERING INFORMATION ESD Protection for Sensitive Electronic Equipment Device Package Shipping I/O Port, Keypad and Button Circuitry Protection for Portable Devices CM120508CP CSP 3500/Tape & Reel Wireless Handsets (PbFree) Handheld PCs / PDAs MP3 Players For information on tape and reel specifications, including part orientation and tape sizes, please Digital Cameras and Camcorders refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Notebooks Desktop PCs Semiconductor Components Industries, LLC, 2011 1 Publication Order Number: August, 2017 Rev. 4 CM1205/DCM1205 PACKAGE / PINOUT DIAGRAMS TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) Orientation Marking + B1 B2 B3 B4 B5 120508 A1 A2 A3 A4 A5 CM120508 10bump CSP Package SPECIFICATIONS Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units Storage Temperature Range 65 to +150 C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 2. STANDARD OPERATING CONDITIONS Parameter Rating Units Operating Temperature Range 40 to +85 C Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Sym- Parameter Conditions Min Typ Max Units bol V Reverse Standoff Voltage I = 10 A 6.0 V REV DIODE I Leakage Current V = 3.3 V DC 100 nA LEAK IN V Signal Clamp Voltage I = 10mA SIG LOAD Positive Clamp 5.6 6.8 8.0 V Negative Clamp 1.2 0.8 0.4 V Insystem ESD Withstand Voltage Note 2 ESD a) Human Body Model, MILSTD883, Method 30 kV 3015 b) Contact Discharge per IEC 6100042 Level 4 25 V Clamping Voltage during ESD Discharge Note 2 CL MILSTD883 (Method 3015), 8 kV Positive Transients +12 V Negative Transients 8 C Channel Capacitance At 2.5 V DC, f = 1 MHz 39 47 pF 1. T = 25 C unless otherwise specified. GND in this document refers to the lower supply voltage. A 2. ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. www.onsemi.com 2