ESD5Z3.3T5G ON Semiconductor

ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series ESD Protection Diode MicroPackaged Diodes for ESD Protection The ESD5Z Series is designed to protect voltage sensitive wwwwww..onsemi.comonsemi.com components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular SOD523 phones, portable devices, digital cameras, power supplies and many CASE 502 other portable applications. STYLE 1 Specification Features: Low Clamping Voltage Small Body Outline Dimensions: 1 2 0.047 x 0.032 (1.20 mm x 0.80 mm) Cathode Anode Low Body Height: 0.028 (0.7 mm) Standoff Voltage: 2.5 V 12 V MARKING DIAGRAM Peak Power up to 240 Watts 8 x 20 s Pulse Low Leakage XX Response Time is Typically < 1 ns 2 1 ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC6100042 Level 4 ESD Protection XX = Specific Device Code IEC6100044 Level 4 EFT Protection M = Date Code = PbFree Package SZ Prefix for Automotive and Other Applications Requiring Unique (Note: Microdot may be in either location) Site and Control Change Requirements AECQ101 Qualified and *Date Code orientation may vary PPAP Capable depending upon manufacturing location. These Devices are PbFree and are RoHS Compliant* Mechanical Characteristics: ORDERING INFORMATION CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V0 Device Package Shipping LEAD FINISH: 100% Matte Sn (Tin) SZ/ESD5ZxxxT1G SOD523 3000 / MOUNTING POSITION: Any PbFree Tape & Reel QUALIFIED MAX REFLOW TEMPERATURE: 260C SZ/ESD5ZxxxT5G SOD523 8000 / Device Meets MSL 1 Requirements PbFree Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics tables starting on page 3 of this data sheet. *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: September, 2018 Rev. 15 ESD5Z2.5T1/D M ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series MAXIMUM RATINGS Rating Symbol Value Unit IEC 6100042 (ESD) kV Contact 30 Air 30 IEC 6100044 (EFT) 40 A ESD Voltage kV Per Human Body Model 16 V Per Machine Model 400 Total Power Dissipation on FR4 Board (Note 1) T = 25C P 500 mW A D Junction and Storage Temperature Range T , T 55 to +150 C J stg Lead Solder Temperature Maximum (10 Second Duration) T 260 C L Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2 1. FR4 printed circuit board, singlesided copper, mounting pad 1 cm . See Application Note AND8308/D for further description of survivability specs. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) A I Symbol Parameter I F I Maximum Reverse Peak Pulse Current PP V Clamping Voltage I C PP V Working Peak Reverse Voltage RWM V V V I Maximum Reverse Leakage Current V C BR RWM R RWM V I V R F V Breakdown Voltage I I BR T T I Test Current T I Forward Current F V Forward Voltage I I F F PP P Peak Power Dissipation pk UniDirectional C Max. Capacitance V = 0 and f = 1 MHz R *See Application Note AND8308/D for detailed explanations of datasheet parameters. www.onsemi.com 2