X-On Electronics has gained recognition as a prominent supplier of FAN3224TUMX-F085 Gate Drivers across the USA, India, Europe, Australia, and various other global locations. FAN3224TUMX-F085 Gate Drivers are a product manufactured by ON Semiconductor. We provide cost-effective solutions for Gate Drivers, ensuring timely deliveries around the world.

FAN3224TUMX-F085 ON Semiconductor

FAN3224TUMX-F085 electronic component of ON Semiconductor
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Part No.FAN3224TUMX-F085
Manufacturer: ON Semiconductor
Category: Gate Drivers
Description: Gate Drivers VEL Gate Driver
Datasheet: FAN3224TUMX-F085 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.9861 ea
Line Total: USD 1.99 
Availability - 1633
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
259
Ship by Mon. 09 Dec to Thu. 12 Dec
MOQ : 1
Multiples : 1
1 : USD 2.4768
10 : USD 2.0419
30 : USD 1.769
100 : USD 1.3835
500 : USD 1.2575
1000 : USD 1.2023

1633
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 1.9861
10 : USD 1.7044
100 : USD 1.4091
250 : USD 1.2628
500 : USD 1.2266
1000 : USD 1.028
2500 : USD 1.028
5000 : USD 0.9958
10000 : USD 0.981

   
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We are delighted to provide the FAN3224TUMX-F085 from our Gate Drivers category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FAN3224TUMX-F085 and other electronic components in the Gate Drivers category and beyond.

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Gate Drivers, High-Speed, Low-Side, Dual 4-A FAN3223/FAN3224/FAN3225 Description The FAN322325 family of dual 4 A gate drivers is designed to drive N channel enhancement mode MOSFETs in low-side www.onsemi.com switching applications by providing high peak current pulses during the short switching intervals. The driver is available with either TTL or CMOS input thresholds. Internal circuitry provides an undervoltage lockout function by holding the output LOW until the SOIC8 8 supply voltage is within the operating range. In addition, the drivers CASE 751EB 1 feature matched internal propagation delays between A and B channels for applications requiring dual gate drives with critical 8 SOIC8 EP timing, such as synchronous rectifiers. This also enables connecting CASE 751AC 1 two drivers in parallel to effectively double the current capability driving a single MOSFET. MARKING DIAGRAMS The FAN322X drivers incorporate MillerDrive architecture for the final output stage. This bipolarMOSFET combination provides 8 8 high current during the Miller plateau stage of the MOSFET turnon / Y&Z&2&K XXXXX turn off process to minimize switching loss, while providing FAN AYWW railtorail voltage swing and reverse current capability. XXXXX The FAN3223 offers two inverting drivers and the FAN3224 offers 1 1 two noninverting drivers. Each device has dual independent enable SOIC8 EP SOIC8 pins that default to ON if not connected. In the FAN3225, each channel has dual inputs of opposite polarity, which allows configuration as XXX = Specific Device Code noninverting or inverting with an optional enable function using the A = Assembly Lot Code second input. If one or both inputs are left unconnected, internal Y = Year resistors bias the inputs such that the output is pulled LOW to hold the WW = Work Week = PbFree Package power MOSFET OFF. Y = ON Semiconductor Logo Graphic Features &Z = Assembly Plant Code IndustryStandard Pinouts &2 = 2Digit Date Code (Year and Week) 4.5 V to 18 V Operating Range &K = 2Digit Lot Run Traceability Code 5 A Peak Sink/Source at V = 12 V (Note: Microdot may be in either location) DD 4.3 A Sink / 2.8 A Source at V = 6 V OUT ORDERING INFORMATION Choice of TTL or CMOS Input Thresholds See detailed ordering and shipping information on page 21 of Three Versions of Dual Independent Drivers: this data sheet. Dual Inverting + Enable (FAN3223) Applications Dual NonInverting + Enable (FAN3224) DualInputs (FAN3225) SwitchMode Power Supplies Internal Resistors Turn Driver Off If No Inputs High-Efficiency MOSFET Switching MillerDrive Technology Synchronous Rectifier Circuits 12 ns / 9 ns Typical Rise/Fall Times (2.2 nF Load) DC-to-DC Converters Under 20 ns Typical Propagation Delay Matched within 1 ns to the Motor Control Other Channel Automotive-Qualified Systems Double Current Capability by Paralleling Channels Related Resources 8Lead SOIC and 8Lead SOIC Exposed Pad Package AN6069 Application Review and Rated from 40C to +125C Ambient Comparative Evaluation of LowSide Gate Drivers Automotive Qualified to AEC-Q100 These are PbFree Devices Semiconductor Components Industries, LLC, 2020 1 Publication Order Number: April, 2020 Rev. 1 FAN3223F085/DFAN3223/FAN3224/FAN3225 PACKAGE OUTLINES 1 8 1 8 2 7 2 7 3 6 3 6 4 5 4 5 Figure 1. SOIC 8 (Top View) Figure 2. SOIC8EP (Top View) THERMAL CHARACTERISTICS (Note 1) L JT JA JB JT (Note 2) (Note 3) (Note 4) (Note 5) (Note 6) Package Unit 8Pin Small Outline Integrated Circuit (SOIC) 38 29 87 41 2.3 C/W 8Pin Small Outline Integrated Circuit with Exposed Pad 5.1 75 40 5.1 7 C/W (SOICEP) 1. Estimates derived from thermal simulation actual values depend on the application. 2. Theta JL ( ): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any thermal pad) JL that are typically soldered to a PCB. 3. Theta JT ( ): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform JT temperature by a top side heatsink. 4. Theta JA ( ): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow. The value given JA is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD512, JESD515, and JESD517, as appropriate. 5. Psi JB ( ): Thermal characterization parameter providing correlation between semiconductor junction temperature and an application JB circuit board reference point for the thermal environment defined in Note 4. For the SOIC8EP package, the board reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the SOIC8 package, the board reference is defined as the PCB copper adjacent to pin 6. 6. Psi JT ( ): Thermal characterization parameter providing correlation between the semiconductor junction temperature and the center of JT the top of the package for the thermal environment defined in Note 4. www.onsemi.com 2

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8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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