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FAN5361 6 MHz, 600 mA / 750 mA Synchronous Buck Regulator FAN5361 6 MHz, 600 mA / 750 mA Synchronous Buck Regulator Description Features The FAN5361 is a 600 mA or 750 mA, step-dow n, sw itching 6 MHz Fixed-Frequency Operation voltage regulator that delivers a fixed output from a 2.3 V to 35 A Typical Quiescent Current 5.5 V input voltage supply. Using a proprietary architecture Best-in-Class Load Transient Response w ith synchronous rectification, the FAN5361 is capable of Best-in-Class Efficiency delivering a peak efficiency of 92%, w hile maintaining 600 mA or 750 mA Output Current Capability efficiency over 80% at load currents as low as 1 mA. 2.3 V to 5.5 V Input Voltage Range The regulator operates at a nominal fixed frequency of 1.0 to 1.90 V Fixed Output Voltage 6 MHz, w hich reduces the value of the external components Low Ripple Light-Load PFM Mode to 470 nH for the output inductor and 4.7 F for the output capacitor. The PWM modulator can be synchronized to an Forced PWM and External Clock Synchronization external frequency source. Internal Soft-Start Input Under-Voltage Lockout (UVLO) At moderate and light loads, pulse frequency modulation is used to operate the device in pow er-save mode w ith a Thermal Shutdow n and Overload Protection typical quiescent current of 35 A. Even w ith such a low 6-bump WLCSP, 0.4 mm Pitch quiescent current, the part exhibits excellent transient 6-pin 2 x 2 mm UMLP response during large load sw ings. At higher loads, the system automatically sw itches to fixed-frequency control, Applications operating at 6 MHz. In shutdow n mode, the supply current drops below 1 A, reducing pow er consumption. For Cell Phones, Smart Phones applications that require minimum ripple or fixed frequency, Tablets, Netbooks , Ultra-Mobile PCs PFM mode can be disabled using the MODE pin. 3G, LTE, WiMAX, WiBro , and WiFi Data Cards Gaming Devices, Digital CamerasDC/DC Micro Modules The FAN5361 is available in 6-bump, 0.4 mm pitch, Wafer- Level Chip-Scale Package (WLCSP) and a 6-lead 2 x 2 mm ultra-thin MLP package (UMLP). Typical Applications GND FB MODE VIN 1 6 A1 A2 C OUT L1 L1 4.7F EN C SW EN IN SW C B1 B2 2 (AGND) 5 IN 2.2F 470nH 470nH 2.2F FB GND VIN C1 C2 MODE 3 4 C 4.7F OUT Figure 1. Typical Applications All trademarks are the property of their respective owners. 2008 Semiconductor Components Industries, LLC. Publication Order Number: October-2017, Rev. 2 FAN5361/D