DATA SHEET www.onsemi.com Integrated Load Switch FDC6330L TSOT236 CASE 419BL Description MARKING DIAGRAM This device is particularly suited for compact power management in portable electronic equipment where 3 V to 20 V input and 2.3 A output current capability are needed. This load switch integrates &E&Y asmall NChannel power MOSFET (Q1) which drives a large &.330&G PChannel power MOSFET (Q2) in one tiny SUPERSOT 6 package. &E = Designates Space Features &Y = Binary Calendar Year Coding Scheme V = 0.20 V V = 12 V, I = 2.5 A, R = 0.08 &. = Pin One Dot DROP IN L (on) 330 = Specific Device Code V = 0.20 V V = 5 V, I = 1.6 A, R = 0.125 DROP IN L (on) &G = Date Code Control MOSFET (Q1) Includes Zener Protection for ESD Ruggedness (> 6 kV Human Body Model) ORDERING INFORMATION High Performance POWERTRENCH Technology for Extremely Low OnResistance Device Package Shipping SUPERSOT6 Package Design Using Copper Lead Frame for FDC6330L TSOT236 3000 / (PbFree) Tape & Reel Superior Thermal and Electrical Capabilities This is a PbFree and Halide Free Device For information on tape and reel specifications, including part orientation and tape sizes, please Application refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Power Management Load Actuation V ,R1 4 3 V , C1 IN OUT Q2 5 ON/OFF 2 V , C1 OUT Q1 R1, C1 6 R2 1 See Application Circuit (Figure 2) Figure 1. V DROP + OUT IN ON/OFF Figure 2. Equivalent Circuit Semiconductor Components Industries, LLC, 1999 1 Publication Order Number: December, 2021 Rev. 3 FDC6330L/DFDC6330L ABSOLUTE MAXIMUM RATINGS T = 25C unless otherwise noted A Symbol Parameter Value Unit V Input Voltage Range (Note 1) 3 20 V IN V On/Off Voltage Range 1.5 8 V ON/OFF I Load Current Continuous (Note 2) 2.3 A D Load Current Pulsed 10 P Maximum Power Dissipation (Note 1) 0.7 W D T , T Operating and Storage Temperature Range 55 to 150 C J STG ESD Electrostatic Discharge Rating MILSTD883D Human Body Model (100 pF / 1500 ) 6 kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS T = 25C unless otherwise noted A Symbol Parameter Value Unit R Thermal Resistance, JunctiontoAmbient (Note 2) 180 C/W JA R Thermal Resistance, JunctiontoCase (Note 2) 60 C/W JC ELECTRICAL CHARACTERISTICS T = 25C unless otherwise noted A Symbol Parameter Test Conditions Min Typ Max Unit OFF CHARACTERISTICS I Leakage Current V = 20 V, V = 0 V 1 A FL IN ON/OFF ON CHARACTERISTICS (Note 3) V Conduction Voltage V = 12 V, V = 3.3 V, I = 2.5 A 0.2 V DROP IN ON/OFF L V = 5 V, V = 3.3 V, I = 1.6 A 0.2 IN ON/OFF L R Q Static OnResistance V = 12 V, I = 2.3 A 0.054 0.08 DS(on) 2 GS D V = 5 V, I = 1.9 A 0.081 0.125 GS D I Load Current A V = 0.2 V, V = 12 V, V = 3.3 V 2.5 L DROP IN ON/OFF V = 0.2 V, V = 5 V, V = 3.3 V 1.6 DROP IN ON/OFF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. NOTES: 1. Range of V can be up to 30 V, but R and R must be scaled such that V of Q2 does not exceed 20 V. in 1 2 GS 2. R is the sum of the junctiontocase and casetoambient thermal resistance where the case thermal reference is defined as the solder JA mounting surface of the drain pins. R is guaranteed by design while R is determined by the users board design. JC JA 3. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%. Q2 IN OUT C1 R1 ON/OFF External Component Recommendation: Load Ci Q1 Co For applications where Co 1 F. For slew rate control, select R2 in the range of 1k 4.7 k . For additional inrush current control, C1 1000 pF can be added. R2 Select R1 so that the R1/R2 ratio ranges from 10100. R1 is required to turn Q2 off. Figure 3. FDC6330L Load Switch Application www.onsemi.com 2