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FDMF5821DC Smart Power Stage (SPS) Module with Integrated Temperature Monitor FDMF5821DC Smart Power Stage (SPS) Module with Integrated Temperature Monitor Features Description The SPS family is ON Semiconductors next-generation, Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip fully optimized, ultra-compact, integrated MOSFET plus Package w ith Flip Chip Low -Side MOSFET and driver power stage solution for high-current, high- Dual Cool Architecture frequency, synchronous buck, DC-DC applications. The High Current Handling: 60 A FDMF5821DC integrates a driver IC with a bootstrap Schottky diode, two power MOSFETs, and a thermal 3-State 5 V PWM Input Gate Driver monitor into a thermally enhanced, ultra-compact, 5 mm Dynamic Resistance Mode for Low -Side Drive x 5 mm package. (LDRV) Slow s Low -Side MOSFET during Negative With an integrated approach, the SPS sw itching pow er Inductor Current Sw itching stage is optimized for driver and MOSFET dynamic Auto DCM (Low -Side Gate Turn Off) Using performance, minimized system inductance, and pow er ZCD Input . The SPS family uses ON MOSFET RDS(ON) Semiconductor s high-performance PowerTrench Thermal Monitor for Module Temperature Reporting MOSFET technology, which reduces switch ringing, Programmable Thermal Shutdow n (P THDN) eliminating the need for a snubber circuit in most buck converter applications. HS-Short Detect Fault / Shutdow n A driver IC with reduced dead times and propagation Dual Mode Enable / Fault Pin delays further enhances the performance. A thermal Internal Pull-Up and Pull-Dow n for ZCD and monitor function warns of a potential over-temperature EN Inputs, respectively situation. A programmable thermal shutdown function turns off the driver if an over-temperature condition ON Semiconductor Pow erTrench MOSFETs for occurs. The FDMF5821DC incorporates an Auto-DCM Clean Voltage Waveforms and Reduced Ringing Mode (ZCD ) for improved light-load efficiency. The ON Semiconductor SyncFET Technology FDMF5821DC also provides a 3-state 5 V PWM input (Integrated Schottky Diode) in Low -Side MOSFET for compatibility w ith a w ide range of PWM controllers. Integrated Bootstrap Schottky Diode Applications Optimized / Extremely Short Dead-Times Servers and Workstations, V-Core and Non-V-Core Under-Voltage Lockout (UVLO) on VCC DC-DC Converters Optimized for Sw itching Frequencies up to 1.5 MHz Desktop and All-in-One Computers, V-Core and PWM Minimum Controllable On-Time: 30 ns Non-V-Core DC-DC Converters Low Shutdow n Current: < 3 A High-Performance Gaming Motherboards Optimized FET Pair for Highest Efficiency: High-Current DC-DC Point-of-Load Converters 10 ~ 15% Duty Cycle Netw orking and Telecom Microprocessor Voltage Operating Junction Temperature Range: Regulators -40C to +125C Small Form-Factor Voltage Regulator Modules ON Semiconductor Green Packaging and RoHS Compliance Ordering Information Part Number Current Rating Package Top Mark FDMF5821DC 60 A 31-Lead, Clip Bond PQFN SPS, 5.0 mm x 5.0 mm Package 5821DC 2013 Semiconductor Components Industries, LLC. Publication Order Number: October-2017, Rev. 2 FDMF5821DC/D