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Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.TM FDPF12N50FT N-Channel UniFET FRFET MOSFET November 2013 FDPF12N50FT TM N-Channel UniFET FRFET MOSFET 500 V, 11.5 A, 700 m Features Description TM R = 590 m (Typ.) V = 10 V, I = 6 A UniFET MOSFET is Fairchild Semiconductors high voltage DS(on) GS D MOSFET family based on planar stripe and DMOS technology. Low Gate Charge (Typ. 21 nC) This MOSFET is tailored to reduce on-state resistance, and to Low C (Typ. 11 pF) rss provide better switching performance and higher avalanche energy strength. The body diodes reverse recovery Fast Switching performance of UniFET FRFET MOSFET has been enhanced 100% Avalanche Tested by lifetime control. Its trr is less than 100nsec and the reverse dv/ Improved dv/dt Capability dt immunity is 15V/ns while normal planar MOSFETs have over 200nsec and 4.5V/nsec respectively. Therefore, it can remove RoHS Compliant additional component and improve system reliability in certain Applications applications in which the performance of MOSFETs body diode is significant. This device family is suitable for switching power LCD/LED/PDP TV converter applications such as power factor correction (PFC), flat panel display (FPD) TV power, ATX and electronic lamp Lighting ballasts. Uninterruptible Power Supply D G G D S TO-220F S o Absolute Maximum Ratings T = 25 C unless otherwise noted. C Symbol Parameter FDPF12N50FT Unit V Drain to Source Voltage 500 V DSS V Gate to Source Voltage 30 V GSS o - Continuous (T = 25 C) 11.5* C I Drain Current A D o - Continuous (T = 100 C) 6.9* C I Drain Current - Pulsed (Note 1) 46* A DM E Single Pulsed Avalanche Energy (Note 2) 456 mJ AS I Avalanche Current (Note 1) 11.5 A AR E Repetitive Avalanche Energy (Note 1) 16.5 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 20 V/ns o (T = 25 C) 42 W C P Power Dissipation D o o - Derate Above 25C0.33W/ C o T , T Operating and Storage Temperature Range -55 to +150 C J STG o T Maximum Lead Temperature for Soldering, 1/8 from Case for 5 Seconds 300 C L *Drain current limited by maximum junction temperature. Thermal Characteristics Symbol Parameter FDPF12N50FT Unit R Thermal Resistance, Junction to Case, Max. 3.0 JC o C/W R Thermal Resistance, Junction to Ambient, Max. 62.5 JA 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com 1 FDPF12N50FT Rev. C2