8 A Standard Recovery Surface Mount Rectifiers FS8G - FS8M Description The FS8G to FS8M series offers breakthrough size and performance. It sinks 8 A DC forward current and provides up to www.onsemi.com 230 A surge current capability with only 0.37 A reverse leakage current. All this capability is packed into a small, flatlead, TO277 Anode 1 package, optimized for spaceconstrained applications. 3 Cathode Anode 2 Features Rectifier Very High forward Surge Capability: I = 230 A FSM Low Leakage Current: 0.37 A at T = 25C 3 A Very Low Profile: Typical Height of 1.1 mm Glass Passivated Junction 2 HBM (JEDEC A114) > 8 KV CDM (JEDEC C101C) > 2 KV 1 Green Molding Compound as per IEC61249 Standard TO2773LD With DAP Option Only CASE 340BQ These Devices are PbFree, Halogen Free Free and are RoHS Compliant MARKING DIAGRAM Applications Y&Z&3 GeneralPurpose Applications * Reverse Polarity Protection Rectifications Y = ON Semiconductor Logo &Z = Assembly Plant Code &3 = Date Code (Year & Week) * = Specific Device Code FS8G, FS8J, FS8K, FS8M ORDERING INFORMATION See detailed ordering and shipping information on page 3 of this data sheet. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: April, 2020 Rev. 5 FS8M/DFS8G FS8M ABSOLUTE MAXIMUM RATINGS (T = 25C unless otherwise noted) A Value FS8G FS8J FS8K FS8M Symbol Rating Unit 400 600 800 1000 V Maximum Repetitive Peak Reverse Voltage V RRM 280 420 560 700 V Maximum RMS Reverse Voltage V RMS 400 600 800 1000 DC Blocking Voltage V V DC I Maximum Average Rectified Forward Current 8 A F(AV) I Peak Forward Surge Current: 8.3 ms Single Half 230 A FSM SineWave Superimposed on Rated Load T Operating Junction Temperature Range 55 to +150 C J T Storage Temperature Range 55 to +150 C STG Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS (T = 25C unless otherwise noted) (Note 1) A Symbol Characteristic Minimum Maximum Unit Land Pattern Land Pattern R JunctiontoAmbient Thermal Resistance 100 40 C/W JA JunctiontoLead Thermal Characteristics, Thermocouple Soldered to Anode 20 12 C/W JL JunctiontoLead Thermal Characteristics, Thermocouple Soldered to Cathode 6 5 1. The thermal resistances (R & ) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1 JA JL and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2). Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils. F S F S F F F S S S Figure 1. Minimum Land Pattern of 2 oz Copper Figure 2. Maximum Land Pattern of 2 oz Copper ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) A Symbol Parameter Conditions Min Typ Max Unit V Forward Voltage I = 8 A 0.951 1.1 V F F I = 8 A, T = 125C 0.845 F A I DC Reverse Current V = V 0.37 5 A R R DC V = V T = 125C 84 R DC, A T Reverse Recovery Time I = 0.5 A, I = 1 A, I = 0.25 A 3.37 s rr F R rr C Junction Capacitance V = 0 V, f = 1 MHz 118 pF J R Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2