Motion SPM 5 Series FSB50550BL, FSB50550BSL General Description The FSB50550BL/FSB50550BSL is an advanced Motion SPM 5 module providing a fullyfeatured, highperformance inverter output stage for AC Induction, BLDC and PMSM motors. These modules www.onsemi.com integrate optimized gate drive of the builtin MOSFETs (FRFET technology) to minimize EMI and losses, while also providing multiple on module protection features including under voltage lockouts and thermal monitoring. The built in highspeed HVIC requires only a single supply voltage and translates the incoming logiclevel gate inputs to the highvoltage, highcurrent drive signals required to properly drive the modules internal MOSFETs. Separate opensource MOSFET terminals are available for each phase to support the widest variety of control algorithms. SPM5E023/23LD Features CASE MODEJ UL Certified No. E209204 (UL1557) Optimized for over 10 kHz Switching Frequency 500 V FRFET MOSFET 3Phase Inverter with Gate Drivers and Protection BuiltIn Bootstrap Diodes Simplify PCB Layout Separate OpenSource Pins from LowSide MOSFETs for ThreePhase CurrentSensing ActiveHIGH Interface, Works with 3.3/5 V Logic, SchmittTrigger Input Optimized for Low Electromagnetic Interference SPM5H023/23LD HVIC TemperatureSensing BuiltIn for Temperature Monitoring CASE MODEM HVIC for Gate Driving and UnderVoltage Protection Isolation Rating: 1500 V /min. rms MARKING DIAGRAM Moisture Sensitive Level (MSL) 3 for SMD PKG This Device is PbFree and is RoHS Compliant ON Applications FSB50550XX ZKKXYY 3Phase Inverter Driver for Small Power AC Motor Drives FSB50550XX = Specific Device Code Related Source XX = BL for FSB50550BL AN9080 Motion SPM 5 Series Version 2 Users Guide = BSL for FSB50550BSL AN9082 Motion SPM 5 Series Thermal Performance by Contact Z = Assembly Code KK = Lot Run Traceability Code Pressure XYY = Date Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Semiconductor Components Industries, LLC, 2019 1 Publication Order Number: November, 2019 Rev. 0 FSB50550BL/DFSB50550BL, FSB50550BSL ORDERING INFORMATION Device Package Packing Type Reel Size Quantity Device Marking FSB50550BL FSB50550BL SPM5E023 Rail NA 15 FSB50550BSL FSB50550BSL SPM5H023 Tape & Reel 330 mm 450 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ABSOLUTE MAXIMUM RATINGS Conditions Symbol Parameter Rating Unit INVERTER PART (Each MOSFET Unless Otherwise Specified) V DrainSource Voltage of Each MOSFET 500 V DSS *I Each MOSFET Drain Current, Continuous T = 25C 3.0 A D 25 C *I Each MOSFET Drain Current, Continuous T = 80C 1.9 A D 80 C *I Each MOSFET Drain Current, Peak T = 25C, PW < 100 s 7.0 A DP C *I Each FRFET Drain Current, Rms T = 80C, F < 20 kHz 1.3 A DRMS C PWM rms CONTROL PART (Each HVIC Unless Otherwise Specified) V Control Supply Voltage Applied between V and COM 20 V DD DD V HighSide Bias Voltage Applied between V and V 20 V BS B S V Input Signal Voltage Applied between V and COM 0.3~V + 0.3 V IN IN DD BOOTSTRAP DIODE PART (Each Bootstrap Diode Unless Otherwise Specified) V Maximum Repetitive Reverse Voltage 500 V RRMB * I Forward Current T = 25C 0.5 A FB C * I Forward Current (Peak) T = 25C, Under 1 ms Pulse Width 2.0 A FPB C THERMAL RESISTANCE R Junction to Case Thermal Resistance Inverter MOSFET Part (Per Module) 2.2 C/W th(j c)Q (Note 1) TOTAL SYSTEM T Operating Junction Temperature 40~150 C J T Storage Temperature 40~125 C STG V Isolation Voltage 60 Hz, Sinusoidal, 1 minute, 1500 V ISO rms Connect Pins to Heat Sink Plate Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. NOTES: 1. For the measurement point of case temperature T , Please refer to Figure 4. C 2. Marking * is calculation value or design factor. www.onsemi.com 2