MC33275, NCV33275 300 mA, Low Dropout Voltage Regulator The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT223, SOP 8, DPAK, and DFN 4x4 surface mount www.onsemi.com packages. These devices feature a very low quiescent current and are capable of supplying output currents up to 300 mA. Internal current and thermal limiting protection are provided by the presence of a short LOW DROPOUT circuit at the output and an internal thermal shutdown circuit. MICROPOWER VOLTAGE Due to the low inputtooutput voltage differential and bias current REGULATOR specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of MARKING useful battery life is desirable. DIAGRAMS Features Low InputtoOutput Voltage Differential of 25 mV at I = 10 mA, O 4 AYW SOT223 and 260 mV at I = 300 mA O 275xx ST SUFFIX 1 Extremely Tight Line and Load Regulation CASE 318E 3 Stable with Output Capacitance of only 0.33 F for 2.5 V Output 1 Voltage 8 Internal Current and Thermal Limiting 275xx SOIC8 NCV Prefix for Automotive and Other Applications Requiring 8 D SUFFIX ALYW Unique Site and Control Change Requirements AECQ100 CASE 751 1 1 Qualified and PPAP Capable These are PbFree Devices Applications 4 275xxG DPAK Battery Powered Consumer Products ALYWW DT SUFFIX 2 1 HandHeld Instruments CASE 369C 3 Camcorders and Cameras 1 V V in out 275xx DFN8, 4x4 MN SUFFIX ALYW CASE 488AF 1 Thermal & Antisat xx = Voltage Version Protection A = Assembly Location L = Wafer Lot Rint Y = Year W, WW = Work Week or G = PbFree Device 1.23 V (Note: Microdot may be in either location) V. Ref. 54 K GND ORDERING INFORMATION This device contains 41 active transistors See detailed ordering and shipping information on page 10 of this data sheet. Figure 1. Simplified Block Diagram Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: March, 2015 Rev. 20 MC33275/DMC33275, NCV33275 PIN CONNECTIONS GND GND 4 4 1 8 Input Output Input 8 2 7 1 Output GND GND Input N/C 2 7 3 6 GND GND Input3 GND 6 12 3 4 5 12 3 N/C N/C N/C 4 5 N/C V GND V GND in out V V in out Pins 4 and 5 Not Connected MC33275ST MC33275DT MC33275D MC33275MN MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage V 13 Vdc CC Power Dissipation and Thermal Characteristics T = 25C A Maximum Power Dissipation P Internally Limited W D Case 751 (SOIC8) D Suffix R 160 C/W Thermal Resistance, JunctiontoAmbient JA R 25 C/W Thermal Resistance, JunctiontoCase JC Case 318E (SOT223) ST Suffix R 245 C/W Thermal Resistance, JunctiontoAir JA R 15 C/W Thermal Resistance, Junction toCase JC Case 369A (DPAK3) DT Suffix Thermal Resistance, JunctiontoAir R 92 C/W JA 6.0 C/W Thermal Resistance, Junction toCase R JC Case 488AF (DFN8, 4x4) MN Suffix 183 C/W Thermal Resistance, JunctiontoAir (with 1.0 oz PCB cu area) R JA 93 C/W Thermal Resistance, JunctiontoAir (with 1.8 oz PCB cu area) R JA 9.0 C/W Thermal Resistance, JunctiontoCase psiJC* Output Current I 300 mA O Maximum Junction Temperature T 150 C J Operating Ambient Temperature Range T 40 to +125 C A Storage Temperature Range T 65 to +150 C stg Electrostatic Discharge Sensitivity (ESD) ESD V Human Body Model (HBM) 4000 Machine Model (MM) 400 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *C (case) is defined as the solderattach interface between the center of the exposed pad on the bottom of the package, and the board to which it is attached. www.onsemi.com 2