MC74AC574NG ON Semiconductor

MC74AC574, MC74ACT574 Octal D FlipFlop with 3State Outputs The MC74AC574/74ACT574 is a highspeed, low power octal flipflop with a buffered common Clock (CP) and a buffered common Output Enable (OE). The information presented to the D inputs is MC74AC574, MC74ACT574 FUNCTIONAL DESCRIPTION FUNCTION TABLE The MC74AC574/74ACT574 consists of eight edge- Inputs Internal Outputs Function triggered flipflops with individual Dtype inputs and OE CP D Q O n 3state true outputs. The buffered clock and buffered Output H H L NC Z Hold Enable are common to all flipflops. The eight flipflops H HH NC Z Hold will store the state of their individual D inputs that meet the H LL Z Load setup and hold time requirements on the LOWtoHIGH H HH Z Load Clock (CP) transition. With the Output Enable (OE) LOW, L LL L Data Available the contents of the eight flipflops are available at the L HH H Data Available outputs. When OE is HIGH, the outputs go to the high L HL NC NC No Change in Data impedance state. Operation of the OE input does not affect L H H NC NC No Change in Data the state of the flipflops. H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance = LOW-to-HIGH Clock Transition NC = No Change D D D D D D D D 0 1 2 3 4 5 6 7 CP CD CD CD CD CD CD CD CD Q Q Q Q Q Q Q Q OE O O O O O O O O 0 1 2 3 4 5 6 7 NOTE: This diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Figure 3. Logic Diagram MAXIMUM RATINGS Symbol Parameter Value Unit V DC Supply Voltage (Referenced to GND) 0.5 to +7.0 V CC V DC Input Voltage (Referenced to GND) 0.5 to V +0.5 V IN CC V DC Output Voltage (Referenced to GND) 0.5 to V +0.5 V OUT CC I DC Input Current, per Pin 20 mA IN I DC Output Sink/Source Current, per Pin 50 mA OUT I DC V or GND Current per Output Pin 50 mA CC CC T Storage Temperature 65 to +150 C stg Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.