MC74HC374A Octal 3-State Non-Inverting D Flip-Flop HighPerformance SiliconGate CMOS The MC74HC374A is identical in pinout to the LS374. The device www.onsemi.com inputs are compatible with standard CMOS outputs with pullup resistors, they are compatible with LSTTL outputs. Data meeting the setup time is clocked to the outputs with the rising edge of the clock. The Output Enable input does not affect the states of the flipflops, but when Output Enable is high, the outputs are forced SOIC20 TSSOP20 DW SUFFIX DT SUFFIX to the highimpedance state thus, data may be stored even when the CASE 751D CASE 948E outputs are not enabled. The HC374A is identical in function to the HC574A which has the PIN ASSIGNMENT input pins on the opposite side of the package from the output. This OUTPUT device is similar in function to the HC534A which has inverting ENABLE 1 V 20 CC outputs. Q0 2 Q7 19 D0 3 D7 18 Features D1 4 D6 17 Output Drive Capability: 15 LSTTL Loads 5 Q1 16 Q6 6 Q2 15 Q5 Outputs Directly Interface to CMOS, NMOS, and TTL D2 7 14 D5 Operating Voltage Range: 2.0 to 6.0 V 8 D4 D3 13 Low Input Current: 1.0 A 9 Q4 Q3 12 10 CLOCK GND 11 High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard MARKING DIAGRAMS No. 7 A 20 20 Chip Complexity: 266 FETs or 66.5 Equivalent Gates HC NLV Prefix for Automotive and Other Applications Requiring HC374A 374A AWLYYWWG Unique Site and Control Change Requirements AECQ100 ALYW Qualified and PPAP Capable 1 1 These Devices are PbFree and are RoHS Compliant SOIC20 TSSOP20 A = Assembly Location LOGIC DIAGRAM WL, L = Wafer Lot YY, Y = Year 2 3 Q0 D0 WW, W = Work Week 5 4 G or = PbFree Package Q1 D1 (Note: Microdot may be in either location) 7 6 D2 Q2 8 9 FUNCTION TABLE DATA D3 Q3 NONINVERTING INPUTS 13 12 Inputs Output D4 OUTPUTS Q4 14 Output D5 15 Q5 Enable Clock D Q 17 D6 16 LHH Q6 18 D7 LLL 19 Q7 L L,H, X No Change 11 CLOCK HX X Z X = dont care PIN 20 = V CC Z = high impedance PIN 10 = GND 1 OUTPUT ENABLE ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: October, 2017 Rev. 15 MC74HC374A/DMC74HC374A MAXIMUM RATINGS Symbol Parameter Value Unit This device contains protection circuitry to guard against damage V DC Supply Voltage (Referenced to GND) 0.5 to +7.0 V CC due to high static voltages or electric V DC Input Voltage (Referenced to GND) 0.5 to V + 0.5 V in CC fields. However, precautions must be taken to avoid applications of any V DC Output Voltage (Referenced to GND) 0.5 to V + 0.5 V out CC voltage higher than maximum rated I DC Input Current, per Pin 20 mA voltages to this highimpedance cir- in cuit. For proper operation, V and in I DC Output Current, per Pin 35 mA out V should be constrained to the out range GND (V or V ) V . I DC Supply Current, V and GND Pins 75 mA in out CC CC CC Unused inputs must always be P Power Dissipation in Still Air, SOIC Package 500 mW D tied to an appropriate logic voltage TSSOP Package 450 level (e.g., either GND or V ). CC Unused outputs must be left open. T Storage Temperature 65 to +150 C stg T Lead Temperature, 1 mm from Case for 10 Seconds C L (SOIC, SSOP or TSSOP Package) 260 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Derating: SOIC Package: 7 mW/ C from 65 to 125 C TSSOP Package: 6.1 mW/ C from 65 to 125 C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit V DC Supply Voltage (Referenced to GND) 2.0 6.0 V CC V , V DC Input Voltage, Output Voltage (Referenced to GND) 0 V V in out CC T Operating Temperature, All Package Types 55 +125 C A t , t Input Rise and Fall Time V = 2.0 V 0 1000 ns r f CC (Figure 1) V = 4.5 V 0 500 CC V = 6.0 V 0 400 CC Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Guaranteed Limit V 55 to CC V 25 C 85 C 125 C Symbol Parameter Test Conditions Unit V Minimum HighLevel Input Voltage V = 0.1 V or V 0.1 V 2.0 1.50 1.50 1.50 V IH out CC I 20 A 3.0 2.10 2.10 2.10 out 4.5 3.15 3.15 3.15 6.0 4.20 4.20 4.20 V Maximum LowLevel Input Voltage V = 0.1 V or V 0.1 V 2.0 0.50 0.50 0.50 V IL out CC I 20 A 3.0 0.90 0.90 0.90 out 4.5 1.35 1.35 1.35 6.0 1.80 1.80 1.80 V Minimum HighLevel Output V = V or V 2.0 1.90 1.90 1.90 V OH in IH IL Voltage 4.5 4.40 4.40 4.40 I 20 A out 6.0 5.90 5.90 5.90 V = V or V I 2.4 mA 3.0 2.48 2.34 2.20 in IH IL out I 6.0 mA 4.5 2.98 3.84 3.70 V out I 7.8 mA 6.0 5.48 5.34 5.20 out V Maximum LowLevel Output V = V or V 2.0 0.10 0.10 0.10 V OL in IH IL Voltage I 20 A 4.5 0.10 0.10 0.10 out 6.0 0.10 0.10 0.10 V = V or V I 2.4 mA 3.0 0.26 0.33 0.40 in IH IL out I 6.0 mA 4.5 0.26 0.33 0.40 V out I 7.8 mA 6.0 0.26 0.33 0.40 out I Maximum Input Leakage Current V = V or GND 6.0 0.1 1.0 1.0 A in in CC www.onsemi.com 2