MM3ZxxxST1G Series, SZMM3ZxxxST1G Series Zener Voltage Regulators 300 mW SOD323 Surface Mount Tight Tolerance Portfolio www.onsemi.com This series of Zener diodes is packaged in a SOD323 surface mount package that has a power dissipation of 300 mW. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, handheld portables, and high density PC boards. SOD323 CASE 477 Specification Features STYLE 1 Standard Zener Breakdown Voltage Range 3.3 V to 36 V Steady State Power Rating of 300 mW 1 2 Small Body Outline Dimensions: Cathode Anode 0.067 x 0.049 (1.7 mm x 1.25 mm) Low Body Height: 0.035 (0.9 mm) MARKING DIAGRAM Package Weight: 4.507 mg/unit ESD Rating of Class 3 (> 16 kV) per Human Body Model Tight Tolerance V Z XXM SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 Qualified and PPAP Capable These Devices are PbFree, Halogen Free/BFR Free and are RoHS XX = Specific Device Code Compliant* M = Date Code* = PbFree Package Mechanical Characteristics: CASE: Void-free, transfer-molded plastic (Note: Microdot may be in either location) FINISH: All external surfaces are corrosion resistant *Date Code orientation may vary MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: depending upon manufacturing location. 260C for 10 Seconds LEADS: Plated with PbSn or Sn only (PbFree) ORDERING INFORMATION POLARITY: Cathode indicated by polarity band Device Package Shipping FLAMMABILITY RATING: UL 94 V0 MOUNTING POSITION: Any MM3ZxxxST1G SOD323 3,000 / (PbFree) Tape & Reel SZMM3ZxxxST1G SOD323 3,000 / (PbFree) Tape & Reel MM3ZxxxST3G SOD323 10,000 / (PbFree) Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION *For additional information on our PbFree strategy and soldering details, please See specific marking information in the device marking download the ON Semiconductor Soldering and Mounting Techniques column of the Electrical Characteristics table on page 3 of this data sheet. Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: December, 2015 Rev. 24 MM3Z2V4ST1/DMM3ZxxxST1G Series, SZMM3ZxxxST1G Series MAXIMUM RATINGS Rating Symbol Max Unit Total Device Dissipation FR4 Board, P D (Note 1) T = 25C 300 mW A Derate above 25C 2.4 mW/C Thermal Resistance from JunctiontoAmbient 416 C/W R JA Junction and Storage Temperature Range T , T 65 to +150 C J stg Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2 1. FR4 printed circuit board, singlesided copper, mounting pad 1 cm . ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted, A V = 0.9 V Max. I = 10 mA for all types) F F Symbol Parameter I V Reverse Zener Voltage I Z ZT I F I Reverse Current ZT Z Maximum Zener Impedance I ZT ZT I Reverse Current ZK V V Z Maximum Zener Impedance I Z R ZK ZK V I V R F I Reverse Leakage Current V I R R ZT V Reverse Voltage R I Forward Current F V Forward Voltage I F F V Maximum Temperature Coefficient of V Z Z Zener Voltage Regulator C Max. Capacitance V = 0 and f = 1 MHz R www.onsemi.com 2