Dual Interface RFID 4 Kb EEPROM Tag ISO 15693 RF 2 and I C Bus Compliant N24RF04 Description The N24RF04 is a RFID/NFC tag with a 4 Kb EEPROM device, www.onsemi.com offering both contactless and contact interface. In addition to the ISO/IEC 15693 radio frequency identification (RFID) interface 2 protocol, the device features an I C interface to communicate with 2 amicrocontroller. The I C contact interface requires an external SOIC 8 TSSOP8, 4.4x3 power supply. CASE 751BD CASE 948AL The 4 Kb EEPROM array is internally organized as 128 x 32 bits in 2 RF mode and as 512 x 8 bits when accessed from the I C interface. PIN CONFIGURATION Features A V 0 CC Contactless Transmission of Data AN 1 A 1 SCL ISO 15693 / ISO 180003 Mode1 Compliant AN 2 Vicinity Range Communication (up to 150 cm) V SDA SS Air Interface Communication at 13.56 MHz (HF) SOIC (W, X), TSSOP (Y) To tag: ASK Modulation with 1.65 Kbit/s or 26.48 Kbit/s Data Rate PIN FUNCTION From Tag: Load Modulation Using Manchester Coding with Pin Name Function 423 kHz and 484 kHz Subcarriers in Low (6.6 Kbit/s) or high (26 Kbit/s) Data Rate Mode. Supports the 53 Kbit/s Data Rate A0, A1 Device Address with Fast Commands SDA Serial Data Read & Write 32bit Block Mode SCL Serial Clock Anticollision Support AN1, AN2 Antenna Coil Security: V Power Supply CC 64bit Unique Identifier (UID) V Ground SS Multiple 32bit Passwords and Lock Feature for Each User Memory Sector 2 Supports Fast (400 kHz) and FastPlus (1 MHz) I C Protocol MARKING DIAGRAMS 1.8 V to 5.5 V Supply Voltage Range 4Byte Page Write Buffer X X 2 AYMZZZ AYMZZZ I C Timeout 2 Schmitt Triggers and Noise Suppression Filters on I C Bus Inputs (SCL and SDA) X = Specific Device Code 128 Blocks x 32 Bits (4 Sectors of 32 Blocks Each): RF Mode A = Assembly Site Code 2 Y = Production Year (Last Digit) 512 x 8 Bits I C Mode M = Production Month Code 2,000,000 Program/Erase Cycles ZZZ = Last 3 Characters of Assembly Lot Number 200 Year Data Retention 40 C to +105 C Temperature Range ORDERING INFORMATION SOIC, TSSOP 8lead Packages See detailed ordering and shipping information on page 19 of this data sheet. These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant* *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2017 1 Publication Order Number: January, 2020 Rev. 2 N24RF04/DN24RF04 V CC AN1 SCL AN2 SDA N24RF04 A0, A1 V SS Figure 1. Functional Symbol Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Rating Unit C Storage Temperature 65 to +150 Ambient Operating Temperature -40 to +105 C Voltage on SCL, SDA, A0, A1 and V pins with respect to Ground (Note 1) 0.5 to 6.5 V CC 28 RF Input Voltage Peak to Peak Amplitude between AN1 and AN2, VSS pad floating V -1 to 15 AC Voltage on AN1 or AN2 with respect to GND V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. During transitions, the voltage undershoot on any pin should not exceed 1 V for more than 20 ns. Voltage overshoot on the SCL and SDA 2 I C pins should not exceed the absolute maximum ratings, irrespective of VCC. Table 2. RELIABILITY CHARACTERISTICS EEPROM (Note 2) Symbol Parameter Test Conditions Max Unit NEND Endurance T 25 C, 1.8 V < V < 5.5 V 2,000,000 CC A Write Cycles (Note 3) T = 85 C, 1.8 V < V < 5.5 V 800,000 A CC T = 105 C, 1.8 V < V < 5.5 V 300,000 CC A TDR Data Retention T = 25 C 200 Year A 2. Determined through qualification/characterization. 3. A Write Cycle refers to writing a Byte or a Page. www.onsemi.com 2