NBXDPA019LNHTAG ON Semiconductor

NBXDPA019 2.5 V / 3.3 V, 125 MHz / 250 MHz LVDS Clock Oscillator The NBXDPA019 dual frequency crystal oscillator (XO) is designed to meet todays requirements for 2.5 V and 3.3 V LVDS NBXDPA019 OE 1 6 V DD FSEL 2 5 CLK GND 3 4 CLK Figure 2. Pin Connections (Top View) Table 1. PIN DESCRIPTION Pin No. Symbol I/O Description 1 OE LVTTL/LVCMOS Output Enable Pin. When left floating pin defaults to logic HIGH and output is active. Control Input See OE pin description Table 2. 2 FSEL LVTTL/LVCMOS Output Frequency Select Pin. Pin will default to logic HIGH when left open. See Output Control Input Frequency Select pin description Table 3. 3 GND Power Supply Ground 0 V 4 CLK LVDS Output NonInverted Clock Output. Typically loaded with 100 receiver termination resistor across differential pair. 5 CLK LVDS Output Inverted Clock Output. Typically loaded with 100 receiver termination resistor across differential pair. 6 V Power Supply Positive power supply voltage. Voltage should not exceed 2.5 V 5% or 3.3 V 10%. DD Table 2. OUTPUT ENABLE TRISTATE FUNCTION Table 3. OUTPUT FREQUENCY SELECT OE Pin Output Pins FSEL Pin Output Frequency (MHz) Open Active Open 125 (pin will float high) HIGH Level Active HIGH Level 125 LOW Level High Z LOW Level 250 Table 4. ATTRIBUTES Characteristic Value Input Default State Resistor 170 k ESD Protection Human Body Model 2 kV Machine Model 200 V Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test 1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D. Table 5. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Units V Positive Power Supply GND = 0 V 4.6 V DD I LVDS Output Current Continuous 25 mA out Surge 50 T Operating Temperature Range 40 to +85 C A T Storage Temperature Range 55 to +120 C stg T Wave Solder See Figure 6 260 C sol Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.