NC7SP00L6X ON Semiconductor

DATA SHEET www.onsemi.com TinyLogic ULP-A NAND Gate MARKING DIAGRAMS NC7SP00 SIP6 1.45X1.0 CCKK The NC7SP00 is a single 2input NAND gate in tiny footprint MicroPak XYZ = packages. The device is designed to operate for V 0.9 V to 3.6 V. CASE 127EB CC Pin 1 Features CC = Specific Device Code Designed for 0.9 V to 3.6 V V Operation CC KK = 2Digit Lot Run Traceability Code 2.4 ns t at 3.3 V (Typ) PD XY = 2Digit Date Code Inputs/Outputs OverVoltage Tolerant up to 3.6 V Z = Assembly Plant Code I Supports Partial Power Down Protection OFF Source/Sink 2.6 mA at 3.3 V SC88A XXXM Available in SC88A and MicroPak Packages CASE 419A02 These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant XXX = Specific Device Code M = Date Code = PbFree Package A 1 6 V A 1 5 CC V CC ORDERING INFORMATION B 2 B 2 5 NC See detailed ordering, marking and shipping information on page 6 of this data sheet. GND 3 4 Y GND 3 4 Y SC88A MicroPak Figure 1. Pinout Diagrams (Top Views) A & Y B Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin SC88A MicroPak Input Output 1 A A A B Y 2 B B L L H 3 GND GND L H H 4 Y Y H L H 5 V N.C. H H L CC 6 V CC N.C. = No Connect Semiconductor Components Industries, LLC, 2004 1 Publication Order Number: October, 2021 Rev. 1 NC7SP00/DNC7SP00 MAXIMUM RATINGS Symbol Characteristics Value Unit V DC Supply Voltage 0.5 to +4.3 V CC V DC Input Voltage 0.5 to +4.3 V IN V DC Output Voltage ActiveMode (High or Low State) 0.5 to V + 0.5 V OUT CC TriState Mode (Note 1) 0.5 to +4.3 PowerDown Mode (V = 0 V) 0.5 to +4.3 CC I DC Input Diode Current V < GND 50 mA IK IN I DC Output Diode Current V < GND 50 mA OK OUT I DC Output Source/Sink Current 50 mA OUT I or I DC Supply Current per Supply Pin or Ground Pin 50 mA CC GND T Storage Temperature Range 65 to +150 C STG T Lead Temperature, 1 mm from Case for 10 Seconds 260 C L T Junction Temperature Under Bias +150 C J Thermal Resistance (Note 2) SC88A 377 C/W JA MicroPak 154 P Power Dissipation in Still Air SC88A 332 mW D MicroPak 812 MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 0.125 in R V ESD Withstand Voltage (Note 3) Human Body Model 2000 V ESD Charged Device Model 1000 I Latchup Performance (Note 4) 100 mA Latchup Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tristated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2 ounce copper trace no air flow per JESD517. 3. HBM tested to EIA / JESD22A114A. CDM tested to JESD22C101A. JEDEC recommends that ESD qualification to EIA/JESD22A115A (Machine Model) be discontinued. 4. Tested to EIA/JESD78 Class II. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit V Positive DC Supply Voltage 0.9 3.6 V CC V DC Input Voltage 0 3.6 V IN V DC Output Voltage ActiveMode (High or Low State) 0 V OUT CC TriState Mode (Note 1) 0 3.6 PowerDown Mode (V = 0 V) 0 3.6 CC T Operating Temperature Range 40 +85 C A t , t Input Transition Rise and Fall Time V = 3.3 V 0.3 V 0 10 ns/V r f CC Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2