NCP114
300 mA CMOS Low Dropout
Regulator
The NCP114 is 300 mA LDO that provides the engineer with a very
stable, accurate voltage with low noise suitable for space constrained,
noise sensitive applications. In order to optimize performance for
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battery operated portable applications, the NCP114 employs the
dynamic quiescent current adjustment for very low I consumption at
Q
noload.
MARKING
DIAGRAMS
Features
UDFN4
Operating Input Voltage Range: 1.7 V to 5.5 V
XX M
MX SUFFIX
Available in Fixed Voltage Options: 0.75 V to 3.6 V
1 CASE 517CU
1
Contact Factory for Other Voltage Options
XX = Specific Device Code
Very Low Quiescent Current of Typ. 50 A
M = Date Code
Standby Current Consumption: Typ. 0.1 A
5
Low Dropout: 135 mV Typical at 300 mA
TSOP5
XXXAYW
SN SUFFIX
1% Accuracy at Room Temperature
CASE 483
High Power Supply Ripple Rejection: 75 dB at 1 kHz
1
Thermal Shutdown and Current Limit Protections
XXX = Specific Device Code
Stable with a 1 F Ceramic Output Capacitor
A = Assembly Location
Y = Year
Available in UDFN and TSOP Packages
W = Work Week
These are PbFree Devices
= PbFree Package
(Note: Microdot may be in either location)
Typical Applicaitons
PDAs, Mobile phones, GPS, Smartphones
PIN CONNECTIONS
Wireless Handsets, Wireless LAN, Bluetooth , Zigbee
EN IN
Portable Medical Equipment
34
Other Battery Powered Applications
V V
IN
OUT
IN OUT
NCP114
C C
IN OUT
EN
1 F
ON
GND
Ceramic
2 1
OFF
GND OUT
(Bottom View)
Figure 1. Typical Application Schematic
IN OUT
1 5
GND
2
EN 4
3 N/C
(Top View)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 15 of this data sheet.
Semiconductor Components Industries, LLC, 2016
1 Publication Order Number:
September, 2017 Rev. 27 NCP114/DNCP114
IN
ENABLE THERMAL
EN
LOGIC SHUTDOWN
BANDGAP
MOSFET
REFERENCE
DRIVER WITH
CURRENT LIMIT
OUT
AUTO LOW
POWER MODE
ACTIVE
DISCHARGE*
EN
GND
*Active output discharge function is present only in NCP114AMXyyyTCG devices.
yyy denotes the particular V option.
OUT
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No. Pin No.
(UDFN4) (TSOP5)
Pin Name Description
1 5 OUT Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 F is need-
ed from this pin to ground to assure stability.
2 2 GND Power supply ground.
3 3 EN
Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into
shutdown mode.
4 1 IN Input pin. A small capacitor is needed from this pin to ground to assure stability.
4 N/C Not connected. This pin can be tied to ground to improve thermal dissipation.
EPAD Exposed pad should be connected directly to the GND pin. Soldered to a large ground cop-
per plane allows for effective heat removal.
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) V 0.3 V to 6 V V
IN
Output Voltage VOUT 0.3 V to VIN + 0.3 V or 6 V V
Enable Input VEN 0.3 V to VIN + 0.3 V or 6 V V
Output Short Circuit Duration tSC s
Maximum Junction Temperature T 150 C
J(MAX)
Storage Temperature T 55 to 150 C
STG
ESD Capability, Human Body Model (Note 2) ESD 2000 V
HBM
ESD Capability, Machine Model (Note 2) ESD 200 V
MM
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22A114,
ESD Machine Model tested per EIA/JESD22A115,
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS (Note 3)
Rating Symbol Value Unit
Thermal Characteristics, UDFN4 1x1 mm R 170 C/W
JA
Thermal Resistance, JunctiontoAir
Thermal Characteristics, TSOP5 R 236 C/W
JA
Thermal Resistance, JunctiontoAir
2
3. Single component mounted on 1 oz, FR 4 PCB with 645 mm Cu area.
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2