NCV51411PWR2G ON Semiconductor

NCV51411 Buck Converter - Low Voltage, Synchronization Capability 1.5 A, 260 kHz NCV51411 D1 1N4148 4.5 V 16 V C1 0.1 F C2 1 U1 2 100 F 3 V BOOST 3.3 V IN V SW L1 4 15 H Shutdown SHDNB NCV51411 R1 5 C3 205 D3 SYNC SYNC 100 F 1N5821 V GND V C FB 8 6 7 R2 127 C4 0.1 F Figure 1. Application Diagram, 4.5 V 16 V to 3.3 V 1.0 A Converter MAXIMUM RATINGS* Rating Value Unit Peak Transient Voltage (31 V Load Dump V = 14 V) 45 V IN Operating Junction Temperature Range, T 40 to 150 C J Lead Temperature Soldering: Reflow: (Note 1) 240 peak C (Note 2) Storage Temperature Range, T 65 to +150 C S ESD (Human Body Model) 2.0 kV (Machine Model) 200 V (Charge Device Model) >1.0 kV Package Thermal Resistance SO8 JunctiontoCase, R 45 C/W JC SO8 JunctiontoAmbient, R 165 C/W JA SO16 JunctiontoCase, R 16 C/W JC SO16 JunctiontoAmbient, R (Note 3) 35 C/W JA 18Lead DFN JunctiontoAmbient, R (Note 3) 38 C/W JA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *The maximum package power dissipation must be observed. 1. 60 second maximum above 183C. 2. 5C/0C allowable conditions. 3. 4 layer board, 1 oz copper outer layers, 0.5 oz copper inner layers, 600 sqmm copper area MAXIMUM RATINGS (Voltages are with respect to GND) Pin Name V V I I Max MIN SOURCE SINK V (DC)* 40 V 0.3 V N/A 4.0 A IN BOOST 40 V 0.3 V N/A 100 mA V 40 V 0.6 V/1.0 V, t < 50 ns 4.0 A 10 mA SW V 7.0 V 0.3 V 1.0 mA 1.0 mA C SHDNB 7.0 V 0.3 V 1.0 mA 1.0 mA SYNC 7.0 V 0.3 V 1.0 mA 1.0 mA V 7.0 V 0.3 V 1.0 mA 1.0 mA FB *See table above for load dump.