NIS5132 Series +12 Volt Electronic Fuse The NIS5132 is a cost effective, resettable fuse which can greatly enhance the reliability of a hard drive or other circuit from both catastrophic and shutdown failures. It is designed to buffer the load device from excessive input voltage which can damage sensitive circuits. It also includes an overvoltage NIS5132 Series VCC Charge Enable Pump ENABLE/ FAULT SOURCE Current Thermal I LIMIT Limit Shutdown UVLO dv/dt dv/dt Voltage Control Clamp* (*MN1 and MN2 versions) GND Figure 1. Block Diagram Table 1. FUNCTIONAL PIN DESCRIPTION Pin Function Description 1 Ground Negative input voltage to the device. This is used as the internal reference for the IC. 2 dv/dt The internal dv/dt circuit controls the slew rate of the output voltage at turn on. It has an internal capacitor that allows it to ramp up over a period of 2 ms. An external capacitor can be added to this pin to increase the ramp time. If an additional time delay is not required, this pin should be left open. 3 Enable/Fault The enable/fault pin is a tristate, bidirectional interface. It can be used to enable or disable the output of the device by pulling it to ground using an open drain or open collector device. If a thermal fault occurs, the voltage on this pin will go to an intermediate state to signal a monitoring circuit that the device is in thermal shutdown. It can also be connected to another device in this family to cause a simultaneous shutdown during thermal events. 4 I A resistor between this pin and the source pin sets the overload and short circuit current limit Limit levels. 610 Source This pin is the source of the internal power FET and the output terminal of the fuse. 11 (belly pad) V Positive input voltage to the device. CC MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage, operating, steadystate (V to GND, Note 1) V 0.6 to 18 V CC IN Transient (100 ms) 0.6 to 25 Thermal Resistance, JunctiontoAir C/W JA 2 0.1 in copper (Note 2) 227 2 0.5 in copper (Note 2) 95 Thermal Resistance, JunctiontoLead (Pin 1) 27 C/W JL Thermal Resistance, JunctiontoCase 20 C/W JC Total Power Dissipation T = 25C P 1.3 W A max Derate above 25C 10.4 mW/C Operating Temperature Range (Note 3) T 40 to 150 C J Nonoperating Temperature Range T 55 to 155 C J Lead Temperature, Soldering (10 Sec) T 260 C L Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Negative voltage will not damage device provided that the power dissipation is limited to the rated allowable power for the package. 2. 1 oz. copper, doublesided FR4. 3. Thermal limit is set above the maximum thermal rating. It is not recommended to operate this device at temperatures greater than the maximum ratings for extended periods of time.