NLVVHC1G03DFT1G ON Semiconductor

M MC74VHC1G03 Single 2Input NOR Gate with Open Drain Output The MC74VHC1G03 is an advanced high speed CMOS 2input NOR gate with an open drain output fabricated with silicon gate CMOS technology. MC74VHC1G03 MAXIMUM RATINGS Symbol Characteristics Value Unit V DC Supply Voltage 0.5 to +7.0 V CC V DC Input Voltage 0.5 to +7.0 V IN V DC Output Voltage V = 0 0.5 to 7.0 V OUT CC High or Low State 0.5 to V + 0.5 CC I Input Diode Current 20 mA IK I Output Diode Current V < GND V > V +20 mA OK OUT OUT CC I DC Output Current, per Pin +25 mA OUT I DC Supply Current, V and GND +50 mA CC CC P Power Dissipation in Still Air at 85C SC705/SC88A 150 mW D TSOP5 200 Thermal Resistance SC705/SC88A (Note 1) 350 C/W JA TSOP5 230 T Lead Temperature, 1 mm from Case for 10 Seconds 260 C L T Junction Temperature Under Bias 150 C J T Storage Temperature Range 65 to 150 C STG MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 0.125 in R V ESD Withstand Voltage Human Body Model (Note 2) > 2000 V ESD Machine Model (Note 3) > 200 Charged Device Model (Note 4) N/A I Latchup Performance Above V and Below GND at 125C (Note 5) 500 mA LATCHUP CC Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow. 2. Tested to EIA/JESD22A114A. 3. Tested to EIA/JESD22A115A. 4. Tested to JESD22C101A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit V DC Supply Voltage 2.0 5.5 V CC V DC Input Voltage 0.0 5.5 V IN V DC Output Voltage 0.0 7.0 V OUT T Operating Temperature Range 55 +125 C A t , t Input Rise and Fall Time V = 3.3 V 0.3 V 0 100 ns/V r f CC V = 5.0 V 0.5 V 0 20 CC DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction FAILURE RATE OF PLASTIC = CERAMIC Temperature C Time, Hours Time, Years UNTIL INTERMETALLICS OCCUR 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 1 110 79,600 9.4 120 37,000 4.2 1 10 100 1000 130 17,800 2.0 TIME, YEARS 140 8,900 1.0 Figure 3. Failure Rate vs. Time Junction Temperature