TTooppss 110000 PPoowweerr WWaarrmm WWhhiittee LLEEDD OOSSMM55XXAAHHDDEE11EE VER . 1 Features Outline Dimension High-power LED Long lifetime operation Typical viewing angle : 140deg RoHS compliant Possible to attach to heat sink directly without using print circuit board. Applications Indoor & outdoor lighting Stage lighting Reading lamps Unit :mm Display cases, furniture illumination, marker Tol erance: 0. 20mm Architectural illumination Tol erances are for reference only Spotlights Absolute Maximum Rating ((((TTTTaaaa====22225555)))) Directivity Item Symbol Value Unit 0 30 30 DC Forward Current *1 I 3,500 mA F Pulse Forward Current*2 I 4,000 mA FP 60 60 Reverse Voltage V 50 V R Power Dissipation*1 P 133,000 mW D 90 90 Operating Temperature Topr -30 ~ +85 1 0.5 0.5 1 0 Storage Temperature Tstg -40~ +100 Lead Soldering Temperature Tsol 260/5sec - *1, Power dissipation and forward current are the value when the module temperature is set lower than the rating by using an adequate heat sink. *2, Pulse width Max.10ms Duty ratio max 1/10 Electrical -Optical Characteristics ((TTaa==2255)) ((TTaa==2255)) Item Symbol Condition Min. Typ. Max. Unit DC Forward Voltage V I =3000mA 29 34 38 V F F DC Reverse Current I V =50V - - 100 A R R v Luminous Flux I =3000mA 4900 6500 - lm F Color Temperature CCT I =3000mA - 3000 - K F Chromaticity x I =3000mA - 0.45 - F Coordinates* y I =3000mA - 0.41 - F 50% Power Angle 21/2 I =3000mA - 140 - deg F Note: Dont drive at rated current more than 5s without heat sink for High Power series. * Tolerance of chromaticity coordinates is +10% , * Tolerance of Luminous Flux is +20% LED & Application Technologies TTooppss 110000 PPoowweerr WWaarrmm WWhhiittee LLEEDD OOSSMM55XXAAHHDDEE11EE VER . 1 Heat design The following pictures show some measurements of mounted 5W Led on the heat sink for each board A and B (See Fig 1) with using thermograph to make an observation about heat distribution. Each boards is tested at various current conditions. As a result, LED needs larger heat sink as much as possible to reduce its own case temperature. Fig. 1 Configuration pattern examples for board assembly Board LED power Material Surface area (m) Min. A 5W Al 10,300 B 10W Al 20,600 C 25W Al 51,500 D 50W Al 103,000 E 100W Al 206,000 F 200W Al 412,000 G 300W Al 618,000 Above tested LED device is attached with adhesive sheet to the heatsink. For reference s sake, Tj absolute maximum rating is defined at 115 as a prerequisite on design process of 5W LED. <Fig.2> Board A (surface area=10,300m) <Fig.3> Board B (surface area=20,600m) IF=600mA IF=600mA LED & Application Technologies