1.6 x 1.5 x 0.55mm Red & Yellow green SMD 1.6 x 1.5 x 0.55mm Red & Yellow green SMD OSRG0603C1C Ver.A.3 Features Outline Dimension Back view Top view Side view Back view Top view Side view OR Bi-Color Super high brightness of surface mount LED Water Clear Flat Mold YG YG Red Red Compact package outline (LxWxT) of 1.6mm x 1.5mm x 0.55mm Cathode mark Anode mark Notes: 1. All dimensions are in Notes: 1. All dimensions are in millimeters Compatible to Reflow soldering. millimeters 2. Tolerance is 0.10 mm unless 2. Tolerance is 0.10 mm unless otherwise noted. otherwise noted. Applications Side view Side view Backlighting (switches, keys, etc.) Marker lights (e.g. steps, exit ways, etc.) Absolute Maximum Rating ((((TTTTaaaa====22225555)))) Directivity Symbo Value 0 Item Unit YG l Red DC Forward Current IF mA 30 30 Pulse Forward Current* IFP 100 100 mA Reverse Voltage V VR 5 5 0 Power Dissipation mW PD 78 78 Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40~ +85 Lead Soldering Temperature - Tsol 260/5sec *Pulse width Max 0.1ms, Duty ratio max 1/10 Electrical -Optical Characteristics ((((TTTTaaaa====22225555)))) 21/2(deg) V (V) I (A) Iv(mcd) D(nm) F R Min. Typ. Max. Max. Min. Typ. Max. Min. Typ. Max. Typ. Part Number Color I =5mA V =5V I =5mA F R F Red HR 1.8 2.1 2.6 10 - 30 - 620 631 640 120 OSRG0603C1C Yellow green YG 1.8 10 20 - 565 570 575 120 2.2 2.6 - Note: * Vf tolerance: 0.05V * Dominant wavelength tolerance: 1nm * Luminous intensity is NIST reading. Luminous intensity tolerance:10% LED & Application Technologies 1.6 x 1.5 x 0.55mm Red & Yellow green SMD 1.6 x 1.5 x 0.55mm Red & Yellow green SMD OSRG0603C1C Ver.A.3 Recommended Soldering Temperature Time Profile (Reflow Soldering) Surface Mounting Condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices. Soldering Reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -We cannot guarantee the LEDs after they have been assembled using the solder dipping method. LED & Application Technologies