OSRP1206C1C Optosupply

33..22 xx 22..77 xx 11..11mmmm RReedd && PPuurree ggrreeeenn SSMMDD OSRP1206C1C VVeerr..AA..11 Features Outline Dimension Bi-Color 1 2 1 2 Super high brightness of surface mount LED 3 4 2 4 Notes: Water Clear Flat Mold 1. All dimensions are in Compact package outline millimeters 2. Tolerance is 0.10 mm (LxWxT) of 3.2mm x 2.7mm x 1.1mm unless otherwise noted. Compatible to IR reflow soldering. Applications Backlighting (switches, keys, etc.) Marker lights (e.g. steps, exit ways, etc.) Absolute Maximum Rating ((((TTTTaaaa====22225555)))) Directivity Value 0 Item Symbol Unit Red PG DC Forward Current I mA 30 30 F Pulse Forward Current* I mA FP 100 100 Reverse Voltage V V 5 5 R 0 Power Dissipation mW P 78 108 D Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40~ +85 Lead Soldering Temperature Tsol 260/5sec - *Pulse width Max 0.1ms, Duty ratio max 1/10 Electrical -Optical Characteristics ((TTaa==2255)) ((TTaa==2255)) 21/2(deg) V (V) I (A) Iv(mcd) D(nm) F R Min. Typ. Max. Max. Min. Typ. Max. Min. Typ. Max. Typ. Part Number Color I =20mA V =5V I =20mA F R F Red HR 1.8 2.1 2.6 10 - 100 - 620 625 630 120 OSRP1206C1C Pure green PG 2.6 10 350 - 515 525 530 120 3.1 3.6 - Note: * Vf tolerance: 0.05V * Dominant wavelength tolerance: 1nm * Luminous intensity is NIST reading. Luminous intensity tolerance:10% LED & Application Technologies 33..22 xx 22..77 xx 11..11mmmm RReedd && PPuurree ggrreeeenn SSMMDD OSRP1206C1C Ver.A.1 Recommended Soldering Temperature Time Profile (Reflow Soldering) Surface Mounting Condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices. Soldering Reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -We cannot guarantee the LEDs after they have been assembled using the solder dipping method. LED & Application Technologies