ENW-89815A3KF Panasonic

CLASSIFICATION PRODUCT SPECIFICATION No. REV. Einstufung Produktspezifikation DS-1x55-2400-102 1.2 SUBJECT CLASS 2 BLUETOOTH MODULE PAGE Thema Bluetooth Modul der Klasse 2 Seite 1 of 35 CUSTOMERS CODE PANASONICS CODE DATE PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015 Product Specification Applicant / Manufacturer Panasonic Industrial Devices Europe GmbH Hardware Zeppelinstrasse 19 21337 Lneburg Germany Applicant / Manufacturer Stollmann Entwicklungs- und Vertriebs-GmbH Software Mendelssohnstrasse 15 D 22761 Hamburg Germany Supported Bluetooth Profiles BlueRS , SPP, HDP, HID, OPP, HDP/SPP By purchase of any of products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required without notification APPROVED CHECKED DESIGNED PANASONIC INDUSTRIAL DEVICES genehmigt geprft erstellt EUROPE GmbH POWER ELECTRONICS R&D CENTER WIRELESS CONNECTIVITY CLASSIFICATION PRODUCT SPECIFICATION No. REV. Einstufung Produktspezifikation DS-1x55-2400-102 1.2 SUBJECT CLASS 2 BLUETOOTH MODULE PAGE Thema Bluetooth Modul der Klasse 2 Seite 2 of 35 CUSTOMERS CODE PANASONICS CODE DATE PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015 TABLE OF CONTENTS 1. Key Features ................................................................................................................. 4 2. Applications for the Module ........................................................................................... 4 3. Description for the Module ............................................................................................. 5 4. Scope of this Document ................................................................................................ 6 5. History for this Document .............................................................................................. 6 6. Terminal Layout ............................................................................................................ 7 6.1. General Pin Assignment ....................................................................................... 8 6.2. Application Specific Pin Description ..................................................................... 9 6.2.1. SPP configuration DCE Mode ................................................................. 9 7. Terminal Specifics ....................................................................................................... 10 7.1. RF-Interface - ANT ............................................................................................. 10 7.2. Power Supply ..................................................................................................... 10 7.3. Power-On-Reset ................................................................................................ 10 7.4. UART Interface TXD, RXD, CTS, RTS ............................................................ 11 7.5. 3-wire Serial Interface ........................................................................................ 12 , 7.6. USB Interface .................................................................................................... 12 7.6.1. USB DP, USB DN ............................................................................... 12 7.7. GPIO Interface ................................................................................................... 12 7.8. ADC ................................................................................................................... 12 7.9. DAC ................................................................................................................... 12 7.10. PCM Interface .................................................................................................... 12 8. Key Parts List .............................................................................................................. 13 9. Test Conditions ........................................................................................................... 14 (1) 10. Absolute Maximum Ratings ..................................................................................... 14 11. Electrical Requirements .............................................................................................. 14 12. I/O Operating Characteristics ...................................................................................... 15 13. USB Interface .............................................................................................................. 15 14. Typical Current Consumption ...................................................................................... 16 14.1. SPP Configuration .............................................................................................. 16 14.1.1. Deep Sleep State .................................................................................. 16 14.1.2. Power Down State ................................................................................ 16 14.1.3. Idle State ............................................................................................... 16 14.2. Power Consumption ........................................................................................... 16 14.3. Power-up time .................................................................................................... 17 15. Electrical RF-Characteristics ....................................................................................... 17 16. Mechanical Requirements ........................................................................................... 18 17. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 19 17.1. For lead solder ................................................................................................... 19 17.2. For leadfree solder ............................................................................................. 19 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH