CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.10
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 1 of 34
CUSTOMERS CODE
PANASONICS CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 27.06.2011
Specification for Production
Applicant / Manufacturer Panasonic Electronic Devices Europe GmbH
Hardware Zeppelinstrasse 19
21337 Lneburg
Germany
Applicant / Manufacturer Stollmann Entwicklungs- und Vertriebs-GmbH
Software Mendelssohnstrasse 15 D
22761 Hamburg
Germany
Supported Bluetooth Profiles BlueRS , SPP, HDP, HID, OPP, HDP/SPP
Contents Approval for Mass Production
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PANASONIC ELECTRONIC DEVICES
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EUROPE GMBH
High Frequency Products Business Group
- Wireless Modules -
CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.10
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 2 of 34
CUSTOMERS CODE
PANASONICS CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 27.06.2011
TABLE OF CONTENTS
1. Key Features...................................................................................................................4
2. Applications for the Module.............................................................................................4
3. Description for the Module ..............................................................................................5
4. Scope of this Document..................................................................................................6
5. History for this Document................................................................................................6
6. Terminal Layout ..............................................................................................................7
6.1. General Pin Assignment ........................................................................................8
6.2. Application Specific Pin Description ......................................................................9
6.2.1. SPP configuration DCE Mode ..................................................................9
7. Terminal Specifics.........................................................................................................10
7.1. RF-Interface - ANT ..............................................................................................10
7.2. Power Supply.......................................................................................................10
7.3. Power-On-Reset ..................................................................................................10
7.4. UART Interface TXD, RXD, CTS, RTS.............................................................11
7.5. 3-wire Serial Interface..........................................................................................12
,
7.6. USB Interface ......................................................................................................12
7.6.1. USB_DP, USB_DN ................................................................................12
7.7. GPIO Interface.....................................................................................................12
7.8. ADC .....................................................................................................................12
7.9. DAC .....................................................................................................................12
7.10. PCM Interface......................................................................................................12
8. Key Parts List................................................................................................................13
9. Test Conditions .............................................................................................................14
(1)
10. Absolute Maximum Ratings .......................................................................................14
11. Electrical Requirements ................................................................................................14
12. I/O Operating Characteristics........................................................................................15
13. USB Interface................................................................................................................15
14. Typical Current Consumption........................................................................................16
14.1. SPP Configuration ...............................................................................................16
14.1.1. Deep Sleep State ...................................................................................16
14.1.2. Power Down State..................................................................................16
14.1.3. Idle State ................................................................................................16
14.2. Power Consumption ............................................................................................16
14.3. Power-up time......................................................................................................17
15. Electrical RF-Characteristics.........................................................................................17
16. Mechanical Requirements.............................................................................................18
17. Soldering Temperature-Time Profile (for reflow soldering) ...........................................19
17.1. For lead solder.....................................................................................................19
17.2. For leadfree solder...............................................................................................19
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